发明申请
US20060189124A1 Semiconductor device having a through contact through a housing composition and method for producing the same
审中-公开
具有通过壳体组合物的直通接触的半导体器件及其制造方法
- 专利标题： Semiconductor device having a through contact through a housing composition and method for producing the same
- 专利标题（中）： 具有通过壳体组合物的直通接触的半导体器件及其制造方法
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申请号： US11350287申请日： 2006-02-09
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公开(公告)号： US20060189124A1公开(公告)日： 2006-08-24
- 发明人: Gottfried Beer , Jens Pohl
- 申请人： Gottfried Beer , Jens Pohl
- 优先权： DE102005006280.6 20050210
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763 ; H01L23/48
摘要：
A semiconductor device includes a housing composition and a through contact extending through the housing composition. The through contact is provided in a contact hole formed through the housing composition and having an asymmetrical funnel form with at least two opposite inner wall sides oriented substantially perpendicular to the top side of the housing and a further inner wall side inclined in such a way that the contact hole has an elongated-hole cross section at the top side of the housing. In the region of the contact pad, the contact hole has a cross section adapted to the contact pad. The through contact includes a contact-making conductor track that extends from the top side of the housing along the inclined fourth inner wall side to the contact pad.
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IPC分类:
