发明申请
US20060191782A1 Magnetron sputtering coater and method of improving magnetic field uniformity thereof
审中-公开
磁控溅射涂布机及其磁场均匀性的提高方法
- 专利标题: Magnetron sputtering coater and method of improving magnetic field uniformity thereof
- 专利标题(中): 磁控溅射涂布机及其磁场均匀性的提高方法
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申请号: US10908068申请日: 2005-04-26
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公开(公告)号: US20060191782A1公开(公告)日: 2006-08-31
- 发明人: Tun-Ho Teng , Chun-Hsia TENG HUANG , Kei-Hsiung YANG , Cheng-Chung Lee , Hsin-Yi Chen , Wei-Chou CHEN
- 申请人: Tun-Ho Teng , Chun-Hsia TENG HUANG , Kei-Hsiung YANG , Cheng-Chung Lee , Hsin-Yi Chen , Wei-Chou CHEN
- 优先权: TW094105832 20050225
- 主分类号: C23C14/32
- IPC分类号: C23C14/32 ; C23C14/00
摘要:
A method of improving the magnetic field uniformity of a magnetron sputtering equipment is disclosed. The method includes providing an equipment having a magnetic field generating device and a magnetic field receiving surface; utilizing the equipment multiple times to acquire the magnetic field intensity distribution on the magnetic field receiving surface; preparing a compensation plate corresponding to the magnetic field intensity distribution, such that the area of the compensation plate corresponding to the area of the magnetic field receiving surface with stronger magnetic field has a stronger ferromagnetic property and the area corresponding to the area of the magnetic field receiving surface with weaker magnetic field has a weaker ferromagnetic property; and installing the compensation plate between the magnetic field generating device and the magnetic field receiving surface for improving the magnetic field uniformity of the magnetic field receiving surface.
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