发明申请
- 专利标题： Wafer level hermetically sealed MEMS device
- 专利标题（中）： 晶圆级气密密封的MEMS器件
-
申请号： US11066820申请日： 2005-02-25
-
公开(公告)号： US20060192272A1公开(公告)日： 2006-08-31
- 发明人: Rogier Receveur , Cornel Marxer
- 申请人： Rogier Receveur , Cornel Marxer
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
A hermetically sealed microelectromechanical system (MEMS) package includes a MEMS switch having a movable portion and a stationary portion with an electrical contact thereon. A glass lid is anodically bonded to the MEMS switch to form a sealed cavity over the movable portion of the MEMS switch. The glass lid includes a contact aperture to allow access to the electrical contact on the stationary portion of the MEMS switch. A family of body-implantable hermetically-sealed MEMS packages are provided according to certain aspects and embodiments of the present invention.
公开/授权文献
- US07816745B2 Wafer level hermetically sealed MEMS device 公开/授权日：2010-10-19