发明申请
- 专利标题： Interconnecting substrate and semiconductor device
- 专利标题（中）： 互连基板和半导体器件
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申请号： US11341445申请日： 2006-01-30
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公开(公告)号： US20060192287A1公开(公告)日： 2006-08-31
- 发明人: Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
- 申请人： Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
- 优先权： JP2005-031100 20050207
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
An interconnecting substrate is provided with a base insulating film having a sunken section in a bottom surface thereof, a first interconnection provided in the sunken section, a via hole formed in the base insulating film, and a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film, wherein the interconnecting substrate comprises a first interconnection pattern formed of the first interconnection which comprises at least a linear pattern which extends along a second direction orthogonal to a first direction, and a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed in such a manner as to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction.
公开/授权文献
- US07745736B2 Interconnecting substrate and semiconductor device 公开/授权日：2010-06-29
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