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公开(公告)号：US07745736B2
公开(公告)日：2010-06-29
申请号：US11341445
申请日：2006-01-30
申请人： Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
发明人： Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
CPC分类号： H05K3/205 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L25/0657 , H01L2221/68345 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/1532 , H01L2924/3511 , H05K1/113 , H05K3/107 , H05K3/4682 , H05K2201/09472 , H05K2201/096 , H05K2203/0384 , H01L2924/00 , H01L2224/0401
摘要： An interconnecting substrate is provided with a base insulating film having a sunken section in a bottom surface thereof, a first interconnection provided in the sunken section, a via hole formed in the base insulating film, and a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film, wherein the interconnecting substrate includes a first interconnection pattern formed of the first interconnection which includes at least a linear pattern which extends along a second direction orthogonal to a first direction, and a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed in such a manner as to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction.
摘要翻译： 互连基板设置有在底面具有下沉部分的基底绝缘膜，设置在凹陷部分中的第一互连，形成在基底绝缘膜中的通孔，以及连接到第一互连件的第二互连 通过所述通孔内的导体，并形成在所述基底绝缘膜的顶表面上，其中所述互连衬底包括由所述第一互连形成的第一互连图案，所述第一互连图案至少包括沿着与第一互连正交的第二方向延伸的线状图案 第一方向和翘曲控制图案，其设置在基底绝缘膜的底面的下沉部分中，并且形成为抑制互连基板朝向底部绝缘膜两侧的底侧的翘曲 第一个方向
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公开(公告)号：US20060192287A1
公开(公告)日：2006-08-31
申请号：US11341445
申请日：2006-01-30
申请人： Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
发明人： Kenta Ogawa , Jun Tsukano , Takehiko Maeda , Tadanori Shimoto , Shintaro Yamamichi , Kazuhiro Baba
IPC分类号： H01L23/52
CPC分类号： H05K3/205 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L25/0657 , H01L2221/68345 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/1532 , H01L2924/3511 , H05K1/113 , H05K3/107 , H05K3/4682 , H05K2201/09472 , H05K2201/096 , H05K2203/0384 , H01L2924/00 , H01L2224/0401
摘要： An interconnecting substrate is provided with a base insulating film having a sunken section in a bottom surface thereof, a first interconnection provided in the sunken section, a via hole formed in the base insulating film, and a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film, wherein the interconnecting substrate comprises a first interconnection pattern formed of the first interconnection which comprises at least a linear pattern which extends along a second direction orthogonal to a first direction, and a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed in such a manner as to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction.
摘要翻译： 互连基板设置有在底面具有下沉部分的基底绝缘膜，设置在凹陷部分中的第一互连，形成在基底绝缘膜中的通孔，以及连接到第一互连件的第二互连 通过所述通孔内的导体，并形成在所述基底绝缘膜的顶表面上，其中所述互连衬底包括由所述第一互连形成的第一互连图案，所述第一互连图案至少包括沿着与第一互连正交的第二方向延伸的线状图案 第一方向和翘曲控制图案，其设置在基底绝缘膜的底面的下沉部分中，并且形成为抑制互连基板朝向底部绝缘膜两侧的底侧的翘曲 第一个方向
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公开(公告)号：US20090137085A1
公开(公告)日：2009-05-28
申请号：US12340267
申请日：2008-12-19
IPC分类号： H01L21/58
CPC分类号： H05K1/0271 , H01L21/4846 , H01L21/563 , H01L21/6835 , H01L23/13 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H05K3/205 , H05K3/4644 , H05K2201/09018 , H05K2201/09481 , H05K2201/09781 , H01L2924/00 , H01L2224/0401
摘要： A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via hole formed in the base insulating film, and a second interconnection provided on a bottom surface side of the base insulating film, the second interconnection being connected to the first interconnection via the via conductor. The wiring substrate includes divided-substrate-unit regions, in each of which the first interconnection, the via conductor, and the second interconnection are formed. The wiring substrate includes a warpage-controlling pattern on the base insulating film, and has a warped shape such that when the wiring substrate is left at rest on a horizontal plate, at least a central part of each side of a plane surface of the substrate contacts the horizontal plate, with both ends of the side raised, where each of the sides extends along a second direction perpendicular to a first direction in the plane surface of the substrate.
摘要翻译： 布线基板包括基底绝缘膜，形成在基底绝缘膜的上表面侧上的第一互连，设置在形成在基底绝缘膜中的通孔中的通孔导体，以及设置在基底绝缘膜的底面侧的第二互连 基底绝缘膜，第二互连件经由通孔导体连接到第一互连件。 布线基板包括分割的基板单元区域，其中形成有第一互连，通孔导体和第二互连。 布线基板包括在基底绝缘膜上的翘曲控制图案，并且具有翘曲形状，使得当布线基板静止在水平板上时，基板的平面的每一侧的至少中心部分 接触水平板，其侧面的两端被凸起，其中每个侧面沿着垂直于基板的平面表面中的第一方向的第二方向延伸。
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公开(公告)号：US07701726B2
公开(公告)日：2010-04-20
申请号：US12340267
申请日：2008-12-19
CPC分类号： H05K1/0271 , H01L21/4846 , H01L21/563 , H01L21/6835 , H01L23/13 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H05K3/205 , H05K3/4644 , H05K2201/09018 , H05K2201/09481 , H05K2201/09781 , H01L2924/00 , H01L2224/0401
摘要： A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via hole formed in the base insulating film, and a second interconnection provided on a bottom surface side of the base insulating film, the second interconnection being connected to the first interconnection via the via conductor. The wiring substrate includes divided-substrate-unit regions, in each of which the first interconnection, the via conductor, and the second interconnection are formed.
摘要翻译： 布线基板包括基底绝缘膜，形成在基底绝缘膜的上表面侧上的第一互连，设置在形成在基底绝缘膜中的通孔中的通孔导体，以及设置在基底绝缘膜的底面侧的第二互连 基底绝缘膜，第二互连件经由通孔导体连接到第一互连件。 布线基板包括分割的基板单元区域，其中形成有第一互连，通孔导体和第二互连。
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5.发明授权公开(公告)号：US07649749B2
公开(公告)日：2010-01-19
申请号：US11822599
申请日：2007-07-09
CPC分类号： H05K1/0271 , H01L21/4846 , H01L21/563 , H01L21/6835 , H01L23/13 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H05K3/205 , H05K3/4644 , H05K2201/09018 , H05K2201/09481 , H05K2201/09781 , H01L2924/00 , H01L2224/0401
摘要： A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via formed in the base insulating film, and a second interconnection provided on a bottom surface side of the base insulating film. The second interconnection is connected to the first interconnection via the via. The wiring substrate includes divided-substrate-unit regions, in each of which the first interconnection, the via, and the second interconnection are formed. The wiring substrate includes a warpage-controlling pattern on the base insulating film, with a warped shape such that when the wiring substrate rests on a horizontal plate, at least a central part of a plane surface of the substrate contacts the horizontal plate, with both ends of the side raised.
摘要翻译： 布线基板包括基底绝缘膜，形成在基底绝缘膜的顶表面侧的第一互连，设置在形成在基底绝缘膜中的通孔中的通孔导体，以及设置在基底绝缘膜的底表面侧的第二互连 基底绝缘膜。 第二互连通过通孔连接到第一互连。 布线基板包括分开的基板单元区域，其中形成有第一互连，通孔和第二互连。 布线基板包括在基底绝缘膜上的翘曲控制图案，具有翘曲形状，使得当布线基板搁置在水平板上时，基板的平面的至少中心部分接触水平板，两者 一边抬起头。
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6.发明授权Wiring board, semiconductor device using wiring board and their manufacturing methods 有权接线板，使用接线板的半导体器件及其制造方法公开(公告)号：US07911038B2
公开(公告)日：2011-03-22
申请号：US12306987
申请日：2007-06-29
申请人： Katsumi Kikuchi , Shintaro Yamamichi , Hideya Murai , Takuo Funaya , Kentaro Mori , Takehiko Maeda , Hirokazu Honda , Kenta Ogawa , Jun Tsukano
发明人： Katsumi Kikuchi , Shintaro Yamamichi , Hideya Murai , Takuo Funaya , Kentaro Mori , Takehiko Maeda , Hirokazu Honda , Kenta Ogawa , Jun Tsukano
IPC分类号： H01L23/495
CPC分类号： H05K3/205 , H01L21/4857 , H01L21/486 , H01L21/563 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48472 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H05K3/244 , H05K3/423 , H05K2201/0338 , H05K2201/098 , H05K2201/09845 , H05K2203/0376 , H05K2203/0384 , H05K2203/0733 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.
摘要翻译： 布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。 在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。 第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。 通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装 。
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公开(公告)号：US07838779B2
公开(公告)日：2010-11-23
申请号：US11452933
申请日：2006-06-15
申请人： Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Kenta Ogawa , Jun Tsukano , Hirokazu Honda
发明人： Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Kenta Ogawa , Jun Tsukano , Hirokazu Honda
CPC分类号： H01L23/49827 , H01L21/486 , H01L21/6835 , H01L23/49811 , H01L23/49822 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/16225 , H01L2224/16235 , H01L2224/32057 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83385 , H01L2224/92125 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06572 , H01L2225/06586 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/1532 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H05K3/0055 , H05K3/20 , H05K3/421 , H05K3/4644 , H05K2201/09563 , H05K2201/09863 , H05K2203/0796 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.
摘要翻译： 在由板状绝缘膜的一面形成的凹部形成有由布线体和蚀刻阻挡层构成的下层布线的布线基板，在基板绝缘膜的另一面形成有上层布线， 绝缘膜，上层布线和下层布线的布线体通过形成在基板绝缘膜上的通孔相互连接。 通孔为桶形，钟形或波纹管状。
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8.发明申请WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE WIRING BOARD COMPOSITE BODY AND THE SEMICONDUCTOR DEVICE 审中-公开接线板复合体，半导体器件及制造接线板复合体和半导体器件的方法公开(公告)号：US20100232127A1
公开(公告)日：2010-09-16
申请号：US12439933
申请日：2007-09-04
申请人： Kentaro Mori , Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Hirokazu Honda , Kenta Ogawa , Jun Tsukano
发明人： Kentaro Mori , Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Hirokazu Honda , Kenta Ogawa , Jun Tsukano
CPC分类号： H05K3/0097 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/181 , H01L2924/3511 , H05K3/007 , H05K2201/0355 , H05K2203/0152 , H05K2203/0156 , H05K2203/1536 , Y10T29/49124 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45015 , H01L2924/207
摘要： A wiring board composite body includes a supporting substrate, and wiring boards formed on each of the upper and the lower surfaces of the supporting substrate. The supporting substrate includes a supporting body, and a metal body arranged on each of the upper and the lower surfaces of the supporting body. The wiring board comprises at least an insulation layer insulating upper and lower wirings, and a via connecting the upper and the lower wirings. The wiring board mounted on the metal body constitutes a wiring board with the metal body. Thus, the supporting body supporting the metal body is effectively used in a process of forming the wiring board on the metal body, and the wiring board composite body, which has advantageous structural and production characteristics, is provided. A semiconductor device and a method for manufacturing such wiring board composite body and the semiconductor device are also provided.
摘要翻译： 布线板复合体包括支撑基板和形成在支撑基板的上表面和下表面中的每一个上的布线板。 支撑基板包括支撑体和布置在支撑体的上表面和下表面中的每一个上的金属体。 布线基板至少包括上下布线绝缘层和连接上下布线的通孔。 安装在金属体上的布线板与金属体构成布线板。 因此，在金属体上形成配线基板的工序中，能够有效地使用支撑金属体的支撑体，具有有利的结构和制造特性的布线基板复合体。 还提供了一种用于制造这种布线板复合体和半导体器件的半导体器件和方法。
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公开(公告)号：US20060283625A1
公开(公告)日：2006-12-21
申请号：US11452933
申请日：2006-06-15
申请人： Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Kenta Ogawa , Jun Tsukano , Hirokazu Honda
发明人： Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Kenta Ogawa , Jun Tsukano , Hirokazu Honda
CPC分类号： H01L23/49827 , H01L21/486 , H01L21/6835 , H01L23/49811 , H01L23/49822 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/16225 , H01L2224/16235 , H01L2224/32057 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83385 , H01L2224/92125 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06572 , H01L2225/06586 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/1532 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H05K3/0055 , H05K3/20 , H05K3/421 , H05K3/4644 , H05K2201/09563 , H05K2201/09863 , H05K2203/0796 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.
摘要翻译： 在由板状绝缘膜的一面形成的凹部形成有由布线体和蚀刻阻挡层构成的下层布线的布线基板，在基板绝缘膜的另一面形成有上层布线， 绝缘膜，上层布线和下层布线的布线体通过形成在基板绝缘膜上的通孔相互连接。 通孔为桶形，钟形或波纹管状。
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公开(公告)号：US08389414B2
公开(公告)日：2013-03-05
申请号：US13026651
申请日：2011-02-14
申请人： Katsumi Kikuchi , Shintaro Yamamichi , Hideya Murai , Takuo Funaya , Kentaro Mori , Takehiko Maeda , Hirokazu Honda , Kenta Ogawa , Jun Tsukano
发明人： Katsumi Kikuchi , Shintaro Yamamichi , Hideya Murai , Takuo Funaya , Kentaro Mori , Takehiko Maeda , Hirokazu Honda , Kenta Ogawa , Jun Tsukano
IPC分类号： H01L21/311
CPC分类号： H05K3/205 , H01L21/4857 , H01L21/486 , H01L21/563 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48472 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H05K3/244 , H05K3/423 , H05K2201/0338 , H05K2201/098 , H05K2201/09845 , H05K2203/0376 , H05K2203/0384 , H05K2203/0733 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.
摘要翻译： 布线基板具有绝缘层，多个布线层以通过绝缘层彼此绝缘的方式形成，以及形成在绝缘层中以连接布线层的多个通孔。 在布线层中，形成在绝缘层的一个表面上的表面布线层包括从一个表面露出的第一金属膜和嵌入在绝缘层中并叠放在第一金属膜上的第二金属膜。 第一金属膜的边缘沿着第二金属膜扩展的方向从第二金属膜的边缘突出。 通过以这种方式设计嵌入在绝缘层中的布线层的形状，可以获得在制造过程中可以有效地防止侧蚀刻的高可靠性布线板，并且可以适应电线的小型化和高密度封装 。
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