发明申请
- 专利标题: Flexible circuit substrate and method of manufacturing the same
- 专利标题(中): 柔性电路基板及其制造方法
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申请号: US11386585申请日: 2006-03-22
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公开(公告)号: US20060215377A1公开(公告)日: 2006-09-28
- 发明人: Tomohiro Nomura , Kazunori Abe , Shozo Yamamuro
- 申请人: Tomohiro Nomura , Kazunori Abe , Shozo Yamamuro
- 申请人地址: JP Nagano-shi
- 专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人地址: JP Nagano-shi
- 优先权: JP2005-083590 20050323
- 主分类号: H05K7/00
- IPC分类号: H05K7/00
摘要:
A wiring layer forming wirings containing inner leads and outer leads are formed on a flexible substrate. Then, inner lead reinforcing electrodes to which a semiconductor chip is connected are formed on the inner leads, outer lead reinforcing electrodes are formed on the outer leads, and wiring reinforcing portions are formed between the inner leads and the outer leads on the wiring layers. The flexible substrate is mounted onto an electronic device by folding a portion to which the wiring reinforcing portions are provided between the inner leads and the outer leads.