发明申请
US20060217830A1 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
审中-公开
半导体制造装置及半导体装置的制造方法
- 专利标题： Semiconductor manufacturing apparatus and semiconductor device manufacturing method
- 专利标题（中）： 半导体制造装置及半导体装置的制造方法
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申请号： US11444454申请日： 2006-06-01
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公开(公告)号： US20060217830A1公开(公告)日： 2006-09-28
- 发明人: Kazuo Saki , Yukihiro Ushiku
- 申请人： Kazuo Saki , Yukihiro Ushiku
- 优先权： JP2001-313918 20011011
- 主分类号： G06F19/00
- IPC分类号： G06F19/00
摘要：
A semiconductor manufacturing apparatus includes a processing apparatus main body which executes a process related to manufacturing a semiconductor device, an internal apparatus controller which supplies a start signal to start a process and a stop signal to stop the process of the semiconductor device within the processing apparatus main body, and a process controller which calculates a physical characteristic of the semiconductor device currently being processed and sends the stop signal to the apparatus controller when a calculated value reaches a predetermined value.