发明申请
- 专利标题： Substrate processing apparatus and substrate processing method
- 专利标题（中）： 基板加工装置及基板处理方法
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申请号： US10513399申请日： 2003-05-16
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公开(公告)号： US20060234508A1公开(公告)日： 2006-10-19
- 发明人: Mitsuhiko Shirakashi , Hozumi Yasuda , Masayuki Kumekawa , Itsuki Kobata
- 申请人： Mitsuhiko Shirakashi , Hozumi Yasuda , Masayuki Kumekawa , Itsuki Kobata
- 优先权： JP2002-143725 20020517; JP2002-170588 20020611; JP2002-382128 20021227
- 国际申请： PCT/JP03/06130 WO 20030516
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/461
摘要：
There is provided a substrate processing apparatus which can process a substrate by using an electrolytic processing method, while reducing a load upon a CMP processing to the least possible extent. The substrate processing apparatus of the present invention includes: an electrolytic processing unit (36) for electrolytically removing the surface of the substrate W having a to-be-processed film formed in said surface, said unit including a feeding section (373) that comes into contact with said surface of the substrate W; a bevel-etching unit (48) for etching away the to-be-processed film remaining unprocessed at the portion of the substrate that has been in contact with the feeding section (373) in the electrolytic processing unit (36); a chemical mechanical polishing unit (34) for chemically and mechanically polishing the surface of the substrate.
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