-
公开(公告)号：US20110237163A1
公开(公告)日：2011-09-29
申请号：US13152374
申请日：2011-06-03
申请人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。
-
公开(公告)号：US07638030B2
公开(公告)日：2009-12-29
申请号：US10669468
申请日：2003-09-25
申请人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
发明人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
CPC分类号： C25F7/00
摘要： An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.
摘要翻译： 一种在完全消除CMP处理或者尽可能减少CMP处理负荷的电解处理装置可以处理和平坦化形成在基板表面上的导电材料，或者可以除去（清洁）附着的附着物 到工件（例如基板）的表面。 本发明包括一个电极部分，它包括平行设置的多个电极部件，每个电极部件包括一个电极和一个覆盖电极表面的离子交换器，一个用于保持工件的保持器，它能使工件靠近 或与电极部件的离子交换器接触，以及要连接到电极部分的每个电极部件的电极的电源。 电极构件的离子交换器包括具有优异表面平滑度的离子交换器和离子交换容量大的离子交换器。
-
公开(公告)号：US06913514B2
公开(公告)日：2005-07-05
申请号：US10602034
申请日：2003-06-23
申请人： Norio Kimura , Huey-Ming Wang , Masayuki Kumekawa
发明人： Norio Kimura , Huey-Ming Wang , Masayuki Kumekawa
CPC分类号： B24B37/205 , B24B49/12
摘要： The system includes a polishing pad, a pad height sensor; a window; and a window raising mechanism. The polishing pad has an aperture with the window vertically moveable therein. The pad height sensor is positioned above the polishing pad and measures the vertical position of the pad before polishing. The window raising mechanism adjusts the vertical position of the window based on information from the pad height sensor. An endpoint measurement sensor can be disposed beneath the window for in-situ measurement of the polishing process.
摘要翻译： 该系统包括抛光垫，垫高度传感器; 一个窗口; 和升起机构。 抛光垫具有孔，其中窗可在其中垂直移动。 焊盘高度传感器位于抛光垫的上方，并在抛光之前测量焊盘的垂直位置。 窗口提升机构根据来自垫高度传感器的信息来调整窗口的垂直位置。 端点测量传感器可以设置在窗户下方，用于原位测量抛光过程。
-
公开(公告)号：US20090291624A1
公开(公告)日：2009-11-26
申请号：US12534465
申请日：2009-08-03
申请人： Seiji KATSUOKA , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji KATSUOKA , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。
-
5.发明授权公开(公告)号：US07569135B2
公开(公告)日：2009-08-04
申请号：US11723934
申请日：2007-03-22
申请人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
发明人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
CPC分类号： C25F7/00 , B23H3/00 , B23H3/04 , B23H3/08 , B23H5/08 , B24B37/04 , C25F3/00 , C25F5/00 , H01L21/32115 , H01L21/3212
摘要： The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.
摘要翻译： 本发明通过使用去离子水，超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。 电解处理设备包括：化学机械抛光部分，用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分，并且还具有设置在基板和处理电极之间或者基板和供电电极之间的至少一个的离子交换器，用于在存在的工件的表面进行电解处理 通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。
-
公开(公告)号：US20080085658A1
公开(公告)日：2008-04-10
申请号：US11905687
申请日：2007-10-03
申请人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
IPC分类号： B24B55/02
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译： 一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。 由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。 基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。 基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。
-
7.发明申请公开(公告)号：US20070181432A1
公开(公告)日：2007-08-09
申请号：US11723934
申请日：2007-03-22
申请人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
发明人： Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Ikutaro Noji , Kaori Yoshida
IPC分类号： C25D5/10
CPC分类号： C25F7/00 , B23H3/00 , B23H3/04 , B23H3/08 , B23H5/08 , B24B37/04 , C25F3/00 , C25F5/00 , H01L21/32115 , H01L21/3212
摘要： The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.
摘要翻译： 本发明通过使用去离子水，超纯水等的电解处理通过化学机械抛光来代替基板处理的全部或一部分。 电解处理设备包括：化学机械抛光部分，用于对基材的表面进行化学机械抛光; 具有处理电极和供电电极的电解处理部分，并且还具有设置在基板和处理电极之间或基板与供电电极之间的至少一个的离子交换器，用于在存在的工件的表面上电解处理 通过在处理电极和馈电电极之间施加电压的解决方案; 以及能够在所述化学机械抛光部和所述处理电极部之间自由移动的顶环。
-
公开(公告)号：US20070034502A1
公开(公告)日：2007-02-15
申请号：US11202899
申请日：2005-08-12
IPC分类号： C25D17/00
CPC分类号： C25D17/001 , C25D17/002 , C25D17/02
摘要： An electrolytic processing apparatus is used to remove a metal film formed on a surface of a substrate. The electrolytic processing apparatus includes a feeding electrode 31 for feeding electricity to a metal film 6 on a substrate W, a processing electrode 32 for processing the metal film 6, a substrate carrier 11 for holding the substrate W, a first supply passage 51 for supplying a first electrolytic processing liquid, a second supply passage 52 for supplying a second electrolytic processing liquid, an insulating member 36 for electrically isolating the first electrolytic processing liquid and the second electrolytic processing liquid, a table 12 on which the feeding electrode 31, the processing electrode 32, and the insulating member 36 are disposed, and a relative movement mechanism 17 for making a relative movement between the table 12 and the substrate carrier 11.
摘要翻译： 使用电解处理装置去除形成在基板表面上的金属膜。 该电解处理装置包括用于向基板W上的金属膜6供电的供电电极31，用于处理金属膜6的处理电极32，用于保持基板W的基板载体11，用于供给的第一供给通道51 第一电解处理液，用于供给第二电解处理液的第二供应通道52，用于电隔离第一电解处理液和第二电解处理液的绝缘构件36，供给电极31，处理 电极32和绝缘部件36，以及用于在工作台12和基板载体11之间进行相对移动的相对移动机构17。
-
公开(公告)号：US07166204B2
公开(公告)日：2007-01-23
申请号：US10204274
申请日：2002-01-23
CPC分类号： H01L21/2885 , C25D5/04 , C25D7/123 , C25D17/001 , C25D17/02 , H01L21/76877
摘要： A plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating apparatus includes a plating bath containing a plating liquid in which an anode is immersed, a head portion for holding a substrate detachably and bringing a lower surface, to be plated, of the substrate into contact with an overflow surface of the plating liquid held in the plating bath, a drive mechanism for rotating the head portion, and a tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane.
摘要翻译： 一种电镀装置和方法，其平滑地进行电镀液体与基板表面的接触，并且能够防止气泡残留在被镀表面上。 电镀装置包括：电镀液，其含有浸渍有阳极的电镀液，可拆卸地保持基板的头部和被镀层的下表面与被保持的电镀液的溢流面接触; 在电镀槽中，用于使头部旋转的驱动机构，以及用于倾斜头部的倾斜机构，使得由头部保持的基板相对于水平面倾斜。
-
公开(公告)号：US20060234508A1
公开(公告)日：2006-10-19
申请号：US10513399
申请日：2003-05-16
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/02087 , B23H5/04 , B23H5/08 , B24B37/345 , C25F3/00 , C25F7/00 , H01L21/0209 , H01L21/32115 , H01L21/6708 , H01L21/6715 , H01L21/67173 , H01L21/67219 , H01L21/6723 , H01L21/7684 , H01L21/76843 , H01L21/76846 , H01L21/76849 , H01L21/76873
摘要： There is provided a substrate processing apparatus which can process a substrate by using an electrolytic processing method, while reducing a load upon a CMP processing to the least possible extent. The substrate processing apparatus of the present invention includes: an electrolytic processing unit (36) for electrolytically removing the surface of the substrate W having a to-be-processed film formed in said surface, said unit including a feeding section (373) that comes into contact with said surface of the substrate W; a bevel-etching unit (48) for etching away the to-be-processed film remaining unprocessed at the portion of the substrate that has been in contact with the feeding section (373) in the electrolytic processing unit (36); a chemical mechanical polishing unit (34) for chemically and mechanically polishing the surface of the substrate.
摘要翻译： 提供了一种基板处理装置，其可以通过使用电解处理方法来处理基板，同时尽可能减少CMP处理时的负载。 本发明的基板处理装置包括：电解处理单元，用于电解去除在所述表面上形成的待处理膜的基板W的表面，所述单元包括来自的进料部分（373） 与基板W的所述表面接触; 斜面蚀刻单元（48），用于在电解处理单元（36）中与已经与供电部分（373）接触的部分处去除未处理的被处理膜; 化学机械抛光单元（34），用于化学和机械地抛光衬底的表面。
-
-
-
-
-
-
-
-
-
搜索结果
26 条记录 (耗时 0.024 秒)
