发明申请
- 专利标题： Passive wafer support for particle free wafer acceleration
- 专利标题（中）： 无源晶片支持无颗粒晶圆加速
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申请号： US11336471申请日： 2006-01-20
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公开(公告)号： US20060236941A1公开(公告)日： 2006-10-26
- 发明人: Harald Herchen
- 申请人： Harald Herchen
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 主分类号： B65G25/00
- IPC分类号： B65G25/00 ; C23C16/00 ; H01L21/306
摘要：
The present invention provides an apparatus and a method of handling and transferring substrate in reduced particle contamination and thermal stress, as well as increased speed. One embodiment of the present invention provides an apparatus for handling a substrate. The apparatus comprises a support plate, and at least one pad protruding an upper surface of the support plate. The pad is configured to support a backside of the substrate so that the backside of the substrate is a first distance away from the upper surface of the support plate. The thermal resistance of the pad is substantially equal to the thermal resistance of the medium between the substrate and the upper surface.
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