发明申请
- 专利标题： MOLDABLE PELTIER THERMAL TRANSFER DEVICE AND METHOD OF MANUFACTURING SAME
- 专利标题（中）： 可弯曲式传热装置及其制造方法
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申请号： US11380300申请日： 2006-04-26
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公开(公告)号： US20060243316A1公开(公告)日： 2006-11-02
- 发明人: Kevin McCullough
- 申请人： Kevin McCullough
- 申请人地址： US RI Warwick
- 专利权人： Cool Shield, Inc.
- 当前专利权人： Cool Shield, Inc.
- 当前专利权人地址： US RI Warwick
- 主分类号： H01L35/30
- IPC分类号： H01L35/30
摘要：
A thermal transfer device includes a body member having a base material of a first semiconductor material of a first type with a filler material dispersed therein of a second semiconductor material of a second type. Electrodes are attached on sides of the body member and electrical current is run therethrough to create thermal flow using the Peltier effect. The device is formed by injection molding and the like and the filler is introduced into the base by, for example, extrusion or pultrusion processes.
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