利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

16 条记录 (耗时 0.013 秒)

    Polymer electronic device package having high thermal conductivity and dielectric strength
    2.
    发明申请
    Polymer electronic device package having high thermal conductivity and dielectric strength 失效
    具有高导热性和介电强度的聚合物电子器件封装

    公开(公告)号：US20050189523A1

    公开(公告)日：2005-09-01

    申请号：US11118057

    申请日：2005-04-29

    申请人： E. Sagal ,  Kevin McCullough ,  James Miller

    发明人： E. Sagal ,  Kevin McCullough ,  James Miller

    IPC分类号： C08K3/22 ,  C08K3/28 ,  H01B3/30 ,  H01B1/00

    CPC分类号： C08K3/22 ,  C08K3/28 ,  H01B3/30 ,  H01B3/301

    摘要： A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.

    摘要翻译： 提供了具有高导热性和介电强度的聚合物组合物。 聚合物组合物包含基础聚合物基质和导热的电绝缘材料。 可以在组合物中添加玻璃等增强材料。 聚合物组合物可以模制成用于诸如电容器，晶体管和电阻器的电子器件的包装组件。

    Method of manufacturing a thermal dissipation assembly
    4.
    发明申请
    Method of manufacturing a thermal dissipation assembly 审中-公开
    制造散热组件的方法

    公开(公告)号：US20050028359A1

    公开(公告)日：2005-02-10

    申请号：US10932606

    申请日：2004-09-02

    申请人： Kevin McCullough

    发明人： Kevin McCullough

    IPC分类号： H01C1/084 ,  H01C17/02 ,  H01L23/427 ,  B05D3/02 ,  H05K7/20

    CPC分类号： H01L23/4275 ,  H01C1/084 ,  H01C17/02 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49099 ,  Y10T29/4913 ,  Y10T29/4935 ,  Y10T29/49353 ,  H01L2924/00

    摘要： The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface surface of the heat sink to form an integral interface layer directly on the heat sink during the manufacturing process. This process includes the steps of providing a heat dissipating device having an interface surface, liquefying the phase change material at a controlled temperature so as to decrease the material viscosity to a flowable form, applying the liquefied phase change material directly onto the mating surface of the heat dissipating device either by directly dispensing the material, screen printing or stencil printing and cooling the material causing it to cure on the surface of the heat dissipating device.

    摘要翻译： 本发明公开了一种在诸如散热器的散热装置的接口表面上提供整体的热界面的方法。 根据本发明，相变材料直接施加到散热器的界面上，在制造过程中直接形成在散热片上的整体界面层。 该方法包括以下步骤：提供具有界面表面的散热装置，在受控温度下使相变材料液化，以将材料粘度降低至可流动的形式，将液化相变材料直接施加到 散热装置通过直接分配材料，丝网印刷或模板印刷和冷却材料使其在散热装置的表面上固化。

    Method of making thermally-conductive casings for optical heads in optical disc players
    5.
    发明授权
    Method of making thermally-conductive casings for optical heads in optical disc players 失效
    在光盘播放器中制造用于光头的导热外壳的方法

    公开(公告)号：US06685855B1

    公开(公告)日：2004-02-03

    申请号：US10459312

    申请日：2003-06-11

    申请人： James Miller ,  Kevin McCullough ,  E. Mikhail Sagal

    发明人： James Miller ,  Kevin McCullough ,  E. Mikhail Sagal

    IPC分类号： B29D1100

    CPC分类号： B29C45/0013 ,  B29K2105/06 ,  B29K2105/16 ,  B29K2995/0013 ,  G11B7/22

    摘要： A method of making a thermally-conductive casing for an optical head in a disc player is provided. The method involves molding a polymer composition comprising: i) about 20% to about 80% by weight of a polymer matrix such as polyphenylene sulfide, and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite into a casing for the optical head. A reinforcing material, such as glass, and other additives, such as flame retardants, can be incorporated into the polymer composition.

    摘要翻译： 提供了一种制造用于光盘播放器中的光头的导热壳体的方法。 该方法包括模制聚合物组合物，其包括：i）约20重量％至约80重量％的聚合物基质例如聚苯硫醚，和ii）约20重量％至约80重量％的导热材料如碳 石墨成为光学头的外壳。 可以在聚合物组合物中加入诸如玻璃的增强材料和其它添加剂，例如阻燃剂。

    IN-MOLD METALLIZED POLYMER COMPONENTS AND METHOD OF MANUFACTURING SAME
    7.
    发明申请
    IN-MOLD METALLIZED POLYMER COMPONENTS AND METHOD OF MANUFACTURING SAME 失效
    模内金属化聚合物组分及其制备方法

    公开(公告)号：US20060234068A1

    公开(公告)日：2006-10-19

    申请号：US11279442

    申请日：2006-04-12

    申请人： Kevin McCullough

    发明人： Kevin McCullough

    IPC分类号： B32B15/08 ,  B32B15/082 ,  C08G73/10

    CPC分类号： B29C45/0013 ,  B29C2045/0015 ,  B29K2055/02 ,  B29K2069/00 ,  B29K2081/04 ,  B29K2705/00 ,  B29K2705/06 ,  B29L2009/003 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31699 ,  Y10T428/31935

    摘要： A method is provided for forming a net shape molded component that includes an integral metallized coating or layer on the exterior surface thereof. The method includes injecting a carefully matched mixture of a molten polymer resin and a molten metallic alloy into a mold cavity under pressure. Due to the differential in material viscosities, the metal tends to migrate to the outer surface of the molded part when placed under pressure, ultimately creating a net shape molded part having a polymer core with a metallic layer at the exterior surfaces thereof. Further, the present invention provides for the compounding of a feedstock suitable for use in conjunction with the method described above.

    摘要翻译： 提供一种形成网状模制部件的方法，该网状模制部件在其外表面上包括整体的金属化涂层或层。 该方法包括将熔融聚合物树脂和熔融金属合金的精心匹配的混合物在压力下注入模腔中。 由于材料粘度的差异，当放置在压力下时，金属倾向于迁移到模制部件的外表面，最终形成具有在其外表面处具有金属层的聚合物芯的网状模制部件。 此外，本发明提供了适合与上述方法结合使用的原料的配混。

    MOLDING COMPOSITION FOR FORMING IN-MOLD METALLIZED POLYMER COMPONENTS
    9.
    发明申请
    MOLDING COMPOSITION FOR FORMING IN-MOLD METALLIZED POLYMER COMPONENTS 失效
    用于形成模内金属化聚合物组分的模塑组合物

    公开(公告)号：US20070264513A1

    公开(公告)日：2007-11-15

    申请号：US11782061

    申请日：2007-07-24

    申请人： Kevin McCullough

    发明人： Kevin McCullough

    IPC分类号： B32B15/08 ,  B29B9/00

    CPC分类号： B29C45/0013 ,  B29C2045/0015 ,  B29K2055/02 ,  B29K2069/00 ,  B29K2081/04 ,  B29K2705/00 ,  B29K2705/06 ,  B29L2009/003 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31699 ,  Y10T428/31935

    摘要： A method is provided for forming a feedstock material for use in net shape molded component that includes an integral metallized coating or layer on the exterior surface thereof. The feedstock includes a carefully matched mixture of polymer resin and a metallic alloy that is suitable for use in a molding method that includes melting and injecting the material into a mold cavity under pressure. Due to the differential in material viscosities, the metal tends to migrate to the outer surface of the molded part when placed under pressure, ultimately creating a net shape molded part having a polymer core with a metallic layer at the exterior surfaces thereof.

    摘要翻译： 提供一种用于形成用于净形状模制部件的原料材料的方法，其中包括在其外表面上的整体金属化涂层或层。 原料包括聚合物树脂和金属合金的精心匹配的混合物，其适用于包括在压力下将材料熔融和注入模腔中的模制方法中使用。 由于材料粘度的差异，当放置在压力下时，金属倾向于迁移到模制部件的外表面，最终形成具有在其外表面处具有金属层的聚合物芯的网状模制部件。