发明申请
- 专利标题： Stacked type semiconductor device
- 专利标题（中）： 堆叠型半导体器件
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申请号： US11399608申请日： 2006-04-07
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公开(公告)号： US20060249829A1公开(公告)日： 2006-11-09
- 发明人: Mitsuaki Katagiri , Masanori Shibamoto , Tsutomu Hara , Koichiro Aoki , Naoya Kanda , Shuji Kikuchi , Hisashi Tanie
- 申请人： Mitsuaki Katagiri , Masanori Shibamoto , Tsutomu Hara , Koichiro Aoki , Naoya Kanda , Shuji Kikuchi , Hisashi Tanie
- 优先权： JP2005-112902 20050408
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A stacked type semiconductor device comprising: a baseboard having a terminal row formed at an end in which connecting terminals is arranged linearly and having a wiring pattern connected to the connecting terminals and external terminals; semiconductor chips having a pad row in which pads is arranged linearly in parallel to the terminal row and being stacked on the baseboard; and interposer boards having a wiring layer including a plurality of wires arranged in parallel with the same length for connecting between pads of the pad row and connecting terminals of the terminal row.
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