发明申请
US20060260946A1 Copper electrolytic process using cation permeable barrier 审中-公开
铜电解工艺采用阳离子渗透屏障

Copper electrolytic process using cation permeable barrier
摘要:
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
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