发明申请
- 专利标题: Copper electrolytic process using cation permeable barrier
- 专利标题(中): 铜电解工艺采用阳离子渗透屏障
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申请号: US11414535申请日: 2006-04-28
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公开(公告)号: US20060260946A1公开(公告)日: 2006-11-23
- 发明人: Rajesh Baskaran , Robert Batz , Bioh Kim , Tom Ritzdorf , John Klocke , Kyle Hanson
- 申请人: Rajesh Baskaran , Robert Batz , Bioh Kim , Tom Ritzdorf , John Klocke , Kyle Hanson
- 申请人地址: US MT Kalispell 59901
- 专利权人: Semitool, Inc.
- 当前专利权人: Semitool, Inc.
- 当前专利权人地址: US MT Kalispell 59901
- 主分类号: C25D5/02
- IPC分类号: C25D5/02
摘要:
Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
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