发明申请
- 专利标题： Wiring board, method for manufacturing same, and semiconductor package
- 专利标题（中）： 接线板，制造方法以及半导体封装
-
申请号： US11452933申请日： 2006-06-15
-
公开(公告)号： US20060283625A1公开(公告)日： 2006-12-21
- 发明人: Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Kenta Ogawa , Jun Tsukano , Hirokazu Honda
- 申请人： Shintaro Yamamichi , Katsumi Kikuchi , Hideya Murai , Takuo Funaya , Takehiko Maeda , Kenta Ogawa , Jun Tsukano , Hirokazu Honda
- 专利权人： NEC CORPORATION,NEC ELECTRONICS CORPORATION
- 当前专利权人： NEC CORPORATION,NEC ELECTRONICS CORPORATION
- 优先权： JP2005-178415 20050617
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/03
摘要：
A wiring board in which lower-layer wiring composed of a wiring body and an etching barrier layer is formed in a concave portion formed on one face of a board-insulating film, upper-layer wiring is formed on the other face of the board-insulating film, and the upper-layer wiring and the wiring body of the lower-layer wiring are connected to each other through a via hole formed in the board-insulating film. The via hole is barrel-shaped, bell-shaped, or bellows-shaped.
公开/授权文献
信息查询
