- 专利标题： Integrated circuit package and integrated circuit module
-
申请号： US11371886申请日： 2006-03-10
-
公开(公告)号： US20060284309A1公开(公告)日： 2006-12-21
- 发明人: Sang-Wook Park , Joong-Hyun Baek , Hyung-Gil Baek
- 申请人： Sang-Wook Park , Joong-Hyun Baek , Hyung-Gil Baek
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 优先权： KR10-2005-0052009 20050616
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other surface of the board. The land pin may be electrically connected to the integrated circuit chip.
信息查询
IPC分类:
