发明申请
- 专利标题： Adhesive tape for electronic components
- 专利标题（中）： 电子元器件胶带
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申请号： US11197322申请日： 2005-08-05
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公开(公告)号： US20060286375A1公开(公告)日： 2006-12-21
- 发明人: Sang-Pil Kim , Ki-Jeong Moon , Woo-Seok Kim
- 申请人： Sang-Pil Kim , Ki-Jeong Moon , Woo-Seok Kim
- 申请人地址： KR Gyeongsangbuk-do
- 专利权人： TORAY SAEHAN INC.
- 当前专利权人： TORAY SAEHAN INC.
- 当前专利权人地址： KR Gyeongsangbuk-do
- 优先权： KR10-2005-0053707 20050621
- 主分类号： B32B7/12
- IPC分类号： B32B7/12
摘要：
An adhesive tape for attaching and fixing electronic components has an adhesive layer on at least one surface of a heat-resistant film. The surface hardness of the adhesive layer is about more than 25 MPa, and the surface hardness of the adhesive layer is about more than 80 MPa after thermosetting at 200° C. for about one hour.
公开/授权文献
- US08057894B2 Adhesive tape for electronic components 公开/授权日：2011-11-15