发明申请
- 专利标题： FORMING INTERCONNECTS
- 专利标题（中）： 形成互联
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申请号： US11467687申请日： 2006-08-28
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公开(公告)号： US20060286726A1公开(公告)日： 2006-12-21
- 发明人: Henning Sirringhaus , Richard Friend , Takeo Kawase
- 申请人： Henning Sirringhaus , Richard Friend , Takeo Kawase
- 专利权人： PLASTIC LOGIC LIMITED
- 当前专利权人： PLASTIC LOGIC LIMITED
- 优先权： GB9930217.6 19991221; GB0009917.6 20000420
- 主分类号： H01L21/84
- IPC分类号： H01L21/84 ; H01L27/148
摘要：
A method for forming an electronic device, comprising: forming a first conductive or semiconductive layer; forming a sequence of at least on insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer; locally depositing solvents at a localized region of the insulating layer so as to dissolve the sequence of insulating and semiconducting layers in the region to leave a void extending through the sequence of layer; and depositing conductive or semiconductive material in the void.
公开/授权文献
- US07763501B2 Forming interconnects 公开/授权日：2010-07-27
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