发明申请
- 专利标题： Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
- 专利标题（中）： 晶圆拆卸方法，晶圆拆卸装置和晶圆拆卸和移印机
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申请号： US10554371申请日： 2003-08-13
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公开(公告)号： US20060286769A1公开(公告)日： 2006-12-21
- 发明人: Masato Tsuchiya , Ikuo Mashimo , Koichi Saito
- 申请人： Masato Tsuchiya , Ikuo Mashimo , Koichi Saito
- 国际申请： PCT/JP03/05947 WO 20030813
- 主分类号： H01L21/30
- IPC分类号： H01L21/30
摘要：
It is an object of the present invention to provide a wafer release method capable of releasing a wafer safely, simply and certainly and improving a wafer releasing rate, a wafer release apparatus and a wafer release transfer machine using the wafer release apparatus. A wafer release method of the present invention comprises the steps of: pressing the uppermost wafer along an axis direction (L-L′) shifted by an angle in the range of from 15 to 75 degrees from a crystal habit line axis (A-A′) or (B-B′) of the uppermost wafer clockwise or counterclockwise; bending upwardly the peripheral portion of the uppermost wafer so as to cause a bending stress in the uppermost wafer in the axis direction (L-L′) shifted by the angle; blowing a fluid into a clearance between the lower surface of the uppermost wafer and the upper surface of the lower wafer adjacent thereto; and raising the uppermost wafer for releasing.
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