发明申请
- 专利标题: Electrode assembly and plasma processing apparatus
- 专利标题(中): 电极组件和等离子体处理装置
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申请号: US11453140申请日: 2006-06-15
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公开(公告)号: US20060288934A1公开(公告)日: 2006-12-28
- 发明人: Chikako Takahashi , Takashi Suzuki , Masato Horiguchi
- 申请人: Chikako Takahashi , Takashi Suzuki , Masato Horiguchi
- 申请人地址: JP Minato-ku
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Minato-ku
- 优先权: JP2005-182479 20050622
- 主分类号: C23C16/00
- IPC分类号: C23C16/00 ; C23F1/00
摘要:
An electrode assembly of a plasma processing apparatus that enables damage to an electrode plate to be prevented, and enables an increase in the number of parts to be prevented so that a worsening of the ability to carry out maintenance can be prevented. An upper electrode assembly has an upper electrode plate 32, a cooling plate (C/P) 34 and a spacer 37 interposed between the upper electrode plate 32 and the C/P 34. The upper electrode plate 32 has therein electrode plate gas-passing holes 32a that penetrate through the upper electrode plate 32. The C/P 34 has therein C/P gas-passing holes 34a that penetrate through the C/P 34. The spacer 37 has therein spacer gas-passing holes 37a that penetrate through the spacer 37. The electrode plate gas-passing holes 32a, C/P gas-passing holes 34a and the spacer gas-passing holes 37a are not disposed collinearly.