- 专利标题： Hermetic cavity package
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申请号： US11174268申请日： 2005-06-29
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公开(公告)号： US20070001287A1公开(公告)日： 2007-01-04
- 发明人: Bruce Bosco , Rudy Emrick , Steven Franson , John Holmes , Stephen Rockwell
- 申请人： Bruce Bosco , Rudy Emrick , Steven Franson , John Holmes , Stephen Rockwell
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers (16, 22) are formed between and hermetically seal the first and second packaging layers (12, 28). First and second conductive strips (18, 20) are formed between the LCP layers (16, 22) and extend into the cavity. An electronic device (24) is positioned within the cavity and is coupled to the first and second conductive strips (18, 20).
公开/授权文献
- US07245009B2 Hermetic cavity package 公开/授权日：2007-07-17
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