公开(公告)号：US20070001287A1

公开(公告)日：2007-01-04

申请号：US11174268

申请日：2005-06-29

申请人： Bruce Bosco ,  Rudy Emrick ,  Steven Franson ,  John Holmes ,  Stephen Rockwell

发明人： Bruce Bosco ,  Rudy Emrick ,  Steven Franson ,  John Holmes ,  Stephen Rockwell

IPC分类号： H01L23/12

CPC分类号： H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1423 ,  H01L2924/3011 ,  H01L2924/00

摘要： A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers (16, 22) are formed between and hermetically seal the first and second packaging layers (12, 28). First and second conductive strips (18, 20) are formed between the LCP layers (16, 22) and extend into the cavity. An electronic device (24) is positioned within the cavity and is coupled to the first and second conductive strips (18, 20).

公开(公告)号：US20060267181A1

公开(公告)日：2006-11-30

申请号：US11139400

申请日：2005-05-27

申请人： Rudy Emrick ,  Bruce Bosco ,  Stephen Rockwell

发明人： Rudy Emrick ,  Bruce Bosco ,  Stephen Rockwell

IPC分类号： H01L23/14

CPC分类号： H01L23/49894 ,  H01L23/145 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/48 ,  H01L25/0657 ,  H01L2223/6627 ,  H01L2224/32145 ,  H01L2224/48235 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1903 ,  H01L2924/19104 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/068 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A device (10) is provided for matching the CTE between substrates (12, 14), e.g., a semiconductor substrate and packaging material. The first substrate (12) has a first coefficient of thermal expansion and the second substrate (14) has a second coefficient of thermal expansion. At least two layers (16) of liquid crystal polymer are formed between the first substrate (12) and the second substrate (14), each layer having a unique coefficient of thermal expansion progressively higher in magnitude from the first substrate (12) to the second substrate (14).

摘要翻译： 提供了一种用于使诸如半导体衬底和包装材料的衬底（12,14）之间的CTE匹配的装置（10）。 第一基板（12）具有第一热膨胀系数，第二基板（14）具有第二热膨胀系数。 在第一基板（12）和第二基板（14）之间形成至少两层液晶聚合物层（16），每层具有从第一基板（12）到第二基板（12）的尺寸逐渐变高的独特的热膨胀系数 第二基板（14）。