发明申请
- 专利标题: Board Supporting mechanism, board supporting method, and component mounting apparatus and component mounting method using the same mechanism and method
- 专利标题(中): 板支撑机构,板支撑方法,以及使用相同机构和方法的部件安装装置和部件安装方法
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申请号: US11480355申请日: 2006-07-05
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公开(公告)号: US20070008709A1公开(公告)日: 2007-01-11
- 发明人: Keishi Ikeya , Kazuo Kido , Tetsutaro Hachimura , Hideki Uchida
- 申请人: Keishi Ikeya , Kazuo Kido , Tetsutaro Hachimura , Hideki Uchida
- 优先权: JP2005-198479 20050707
- 主分类号: H05K7/02
- IPC分类号: H05K7/02 ; H05K3/00 ; B23P19/00
摘要:
The present invention provides a board supporting mechanism and a board supporting method eliminating an adjustment of a support height of a support pin upon position-changing of the support pin in accordance with a change in model of a circuit board, as well as a component mounting apparatus and a component mounting method. A single or a plurality of support pin(s) (42) having one end(s) brought into contact with a bottom face of a circuit board (14) to support the bottom face of the circuit board (14) and the other end(s) brought into contact with a surface of a support table (27) for raising/lowering the support pin(s) (42) is or are held in a direction substantially perpendicular to the surface of the support table (27). The one end(s) of the support pin(s) (42) held in the direction substantially perpendicular to the surface of the support table (27) is or are brought into contact with the bottom face of the circuit board (14); thus, the support pin(s) (42) support(s) the circuit board (14).
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