公开(公告)号：US07447045B2

公开(公告)日：2008-11-04

申请号：US11480355

申请日：2006-07-05

申请人： Keishi Ikeya ,  Kazuo Kido ,  Tetsutaro Hachimura ,  Hideki Uchida

发明人： Keishi Ikeya ,  Kazuo Kido ,  Tetsutaro Hachimura ,  Hideki Uchida

IPC分类号： H05K7/14

CPC分类号： H05K13/0069 ,  H05K7/142 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49153 ,  Y10T29/53174 ,  Y10T29/53265

摘要： A board supporting mechanism and a board supporting method eliminating an adjustment of a support height of a support pin upon position-changing of the support pin in accordance with a change in the model of a circuit board, as well as a component mounting apparatus and a component mounting method. A single or a plurality of support pin(s) (42) have one end(s) and are brought into contact with a bottom face of a circuit board (14) to support the bottom face of the circuit board (14) and the other end(s) are brought into contact with a surface of a support table (27) for raising/lowering the support pin(s) (42). Each support pin is held in a direction substantially perpendicular to the surface of the support table (27). The one end(s) of the support pin (42), held in the direction substantially perpendicular to the surface of the support table (27), is brought into contact with the bottom face of the circuit board (14), and thereby, the support pins support the circuit board (14).

摘要翻译： 板支撑机构和板支撑方法，根据电路板的型号的变化，消除了在支撑销的位置变化时支撑销的支撑高度的调整，以及部件安装装置和 组件安装方法。 一个或多个支撑销（42）具有一个端部并与电路板（14）的底面接触以支撑电路板（14）的底面，并且 另一端与支撑台（27）的表面接触，用于升高/降低支撑销（42）。 每个支撑销保持在基本上垂直于支撑台（27）的表面的方向上。 保持在与支撑台（27）的表面大致垂直的方向上的支撑销（42）的一端与电路板（14）的底面接触， 支撑销支撑电路板（14）。

公开(公告)号：US20070008709A1

公开(公告)日：2007-01-11

申请号：US11480355

申请日：2006-07-05

申请人： Keishi Ikeya ,  Kazuo Kido ,  Tetsutaro Hachimura ,  Hideki Uchida

发明人： Keishi Ikeya ,  Kazuo Kido ,  Tetsutaro Hachimura ,  Hideki Uchida

IPC分类号： H05K7/02 ,  H05K3/00 ,  B23P19/00

CPC分类号： H05K13/0069 ,  H05K7/142 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49153 ,  Y10T29/53174 ,  Y10T29/53265

摘要： The present invention provides a board supporting mechanism and a board supporting method eliminating an adjustment of a support height of a support pin upon position-changing of the support pin in accordance with a change in model of a circuit board, as well as a component mounting apparatus and a component mounting method. A single or a plurality of support pin(s) (42) having one end(s) brought into contact with a bottom face of a circuit board (14) to support the bottom face of the circuit board (14) and the other end(s) brought into contact with a surface of a support table (27) for raising/lowering the support pin(s) (42) is or are held in a direction substantially perpendicular to the surface of the support table (27). The one end(s) of the support pin(s) (42) held in the direction substantially perpendicular to the surface of the support table (27) is or are brought into contact with the bottom face of the circuit board (14); thus, the support pin(s) (42) support(s) the circuit board (14).

摘要翻译： 本发明提供了一种板支撑机构和板支撑方法，其根据电路板型号的变化，消除了在支撑销位置变化时支撑销的支撑高度的调整，以及元件安装 装置和部件安装方法。 一个或多个支撑销（42），其一端与电路板（14）的底面接触以支撑电路板（14）的底面，另一端 与用于升降支撑销（42）的支撑台（27）的表面接触的方向被保持在基本上垂直于支撑台（27）的表面的方向上。 保持在与支撑台（27）的表面大致垂直的方向上的支撑销（42）的一端或与电路板（14）的底面接触; 因此，支撑销（42）支撑电路板（14）。

公开(公告)号：US6132167A

公开(公告)日：2000-10-17

申请号：US29102

申请日：1998-02-20

申请人： Keishi Ikeya ,  Makoto Sueki ,  Hideki Uchida ,  Kazuhiko Narikiyo

发明人： Keishi Ikeya ,  Makoto Sueki ,  Hideki Uchida ,  Kazuhiko Narikiyo

IPC分类号： B23P19/00 ,  H05K13/02 ,  H05K13/04

CPC分类号： H05K13/021 ,  H05K13/02 ,  H05K13/0434 ,  Y10T29/53478

摘要： A method of and apparatus for feeding electronic components are provided in which a group of electronic components joined to each other and stored in a stick are separated from each other before being supplied, regardless of the configuration at the joining ends of the electronic components as well as the presence of burrs developed during a molding process of the electronic components. In particular, a separating unit (6) comprises a step (20) which is dropped in level at the front end of a tilted chute (4) for receiving the forefront electronic component (2) and an arm (22) for holding down the succeeding electronic component (2) from above and causing the same to move backward along the tilted chute (4).

摘要翻译： PCT No.PCT / JP97 / 02168 Sec。 371日期：1998年2月20日 102（e）1998年2月20日PCT PCT 1996年6月26日PCT公布。 公开号WO97 / 50284 日期1997年12月31日提供了一种用于馈送电子部件的方法和装置，其中一组彼此连接并存储在棒中的电子部件在供给之前彼此分离，而不管接合端的结构如何 电子部件以及在电子部件的模制过程中产生的毛刺的存在。 特别地，分离单元（6）包括台阶（20），该台阶（20）在倾斜的斜槽（4）的前端处水平地落下，用于接收最前面的电子部件（2）和用于将 后面的电子部件（2），并使其沿着倾斜的滑槽（4）向后移动。

公开(公告)号：US5727922A

公开(公告)日：1998-03-17

申请号：US521050

申请日：1995-08-29

申请人： Keishi Ikeya ,  Kanji Uchida ,  Makoto Sueki ,  Hideki Uchida

发明人： Keishi Ikeya ,  Kanji Uchida ,  Makoto Sueki ,  Hideki Uchida

IPC分类号： B25J15/06 ,  H05K13/04 ,  B65G69/00

CPC分类号： H05K13/0413

摘要： In an electronic component transfer method and apparatus, an electronic component is placed on a suctional top surface of a suction nozzle brought into a protruded posture relative to a component fixing block while the electronic component is drawn by suction by a transfer nozzle which is movable up and down, the electronic component placed on the component fixing block is pressed from above with the transfer nozzle so that the electronic component is sandwiched between the transfer nozzle and the suction nozzle, a position of the suction nozzle is fixed by the suction nozzle fixing stopper, and, in this state, the electronic component is held on the component fixing block by the holding members.

摘要翻译： 在一种电子部件传送方法和装置中，电子部件被放置在相对于部件固定块形成为突出姿态的吸嘴的吸引顶面上，同时电子部件通过可移动的传送喷嘴被抽吸 放置在部件固定块上的电子部件用传送喷嘴从上方被按压，使得电子部件被夹在传送喷嘴和吸嘴之间，吸嘴的位置被吸嘴固定塞固定 ，并且在该状态下，电子部件被保持部件保持在部件固定块上。