发明申请
- 专利标题： Semiconductor device and method of manufacturing the same
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US11513054申请日： 2006-08-31
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公开(公告)号： US20070015323A1公开(公告)日： 2007-01-18
- 发明人: Atsuo Isobe , Shunpei Yamazaki , Chiho Kokubo , Koichiro Tanaka , Akihisa Shimomura , Tatsuya Arao , Hidekazu Miyairi , Mai Akiba
- 申请人： Atsuo Isobe , Shunpei Yamazaki , Chiho Kokubo , Koichiro Tanaka , Akihisa Shimomura , Tatsuya Arao , Hidekazu Miyairi , Mai Akiba
- 申请人地址： JP Atsugi-shi
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP Atsugi-shi
- 优先权： JP2002-019286 20020128; JP2002-027381 20020204
- 主分类号： H01L21/84
- IPC分类号： H01L21/84
摘要：
An objective is to provide a method of manufacturing a semiconductor device, and a semiconductor device manufactured by using the manufacturing method, in which a laser crystallization method is used that is capable of preventing the formation of grain boundaries in TFT channel formation regions, and is capable of preventing conspicuous drops in TFT mobility, reduction in the ON current, and increases in the OFF current, all due to grain boundaries. Depressions and projections with stripe shape or rectangular shape are formed. Continuous wave laser light is then irradiated to a semiconductor film formed on an insulating film along the depressions and projections with stripe shape of the insulating film, or along a longitudinal axis direction or a transverse axis direction of the rectangular shape. Note that although it is most preferable to use continuous wave laser light at this point, pulse wave laser light may also be used.
公开/授权文献
- US07737506B2 Semiconductor device and method of manufacturing the same 公开/授权日：2010-06-15
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