An inductively coupled plasma processing apparatus is disclosed. The inductively coupled plasma processing apparatus includes a reaction chamber, a substrate holder for forming a plasma space in the reaction chamber and for supporting a processing substrate therein, a shield provided at the lateral side of the substrate holder, a plurality of openings formed below the substrate, and a linear antenna in the lower portion of the reaction chamber to which a high frequency power signal is applied. Thus, the inductively coupled plasma processing apparatus can uniformly distribute the density of the plasma so that a large-sized flat panel display can be implemented.