发明申请
- 专利标题: SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURE THEREOF
- 专利标题(中): 半导体封装器件及其制造
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申请号: US11470870申请日: 2006-09-07
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公开(公告)号: US20070018333A1公开(公告)日: 2007-01-25
- 发明人: Chen-Jung TSAI , Jui-Chung LEE , Chih-Wen LIN
- 申请人: Chen-Jung TSAI , Jui-Chung LEE , Chih-Wen LIN
- 申请人地址: TW HSIN-CHU CITY
- 专利权人: MACRONIX INTERNATIONAL CO., LTD.
- 当前专利权人: MACRONIX INTERNATIONAL CO., LTD.
- 当前专利权人地址: TW HSIN-CHU CITY
- 主分类号: H01L23/52
- IPC分类号: H01L23/52
摘要:
A semiconductor packaging device comprises a carrier having at least a cavity/a slot thereon, at least a chip has a back surface and an active surface with a plurality of first bonding pads. The chip is affixed to the cavity to expose the active surface. A first insulating layer is on the active surface and the carrier comprises first plating through holes connected to first bonding pads and via the first insulating layer. A multi-layer structure on the first insulating layer comprises a plurality of conductive layout lines, second plating through holes therein, and a second insulating layer, exposed ball pads, and flip-chip pads thereon. The first plating through holes are electrically connected with the conductive layout lines, the second plating through holes, the exposed ball pads, and the flip-chip pads. The first solder balls are affixed to the ball pads.