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公开(公告)号:US20070018333A1
公开(公告)日:2007-01-25
申请号:US11470870
申请日:2006-09-07
申请人: Chen-Jung TSAI , Jui-Chung LEE , Chih-Wen LIN
发明人: Chen-Jung TSAI , Jui-Chung LEE , Chih-Wen LIN
IPC分类号: H01L23/52
CPC分类号: H01L23/5389 , H01L23/49816 , H01L24/19 , H01L25/0652 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/12105 , H01L2224/16225 , H01L2224/24137 , H01L2224/73267 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/18162 , H01L2924/00
摘要: A semiconductor packaging device comprises a carrier having at least a cavity/a slot thereon, at least a chip has a back surface and an active surface with a plurality of first bonding pads. The chip is affixed to the cavity to expose the active surface. A first insulating layer is on the active surface and the carrier comprises first plating through holes connected to first bonding pads and via the first insulating layer. A multi-layer structure on the first insulating layer comprises a plurality of conductive layout lines, second plating through holes therein, and a second insulating layer, exposed ball pads, and flip-chip pads thereon. The first plating through holes are electrically connected with the conductive layout lines, the second plating through holes, the exposed ball pads, and the flip-chip pads. The first solder balls are affixed to the ball pads.
摘要翻译: 半导体封装装置包括至少具有空腔/槽的载体,至少芯片具有后表面和具有多个第一接合焊盘的活性表面。 芯片固定在腔体上以露出活性表面。 第一绝缘层位于有源表面上,并且载体包括通过连接到第一接合焊盘并经由第一绝缘层的孔的第一电镀。 第一绝缘层上的多层结构包括多个导电布线,其中第二电镀通孔,第二绝缘层,暴露的球垫和倒装垫片。 第一电镀通孔与导电布线,第二电镀通孔,暴露的球垫和倒装芯片电连接。 第一个焊球固定在球垫上。