发明申请
- 专利标题: Controllable target cooling
- 专利标题(中): 可控制目标冷却
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申请号: US11190389申请日: 2005-07-27
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公开(公告)号: US20070023275A1公开(公告)日: 2007-02-01
- 发明人: Yoshiaki Tanase , Makoto Inagawa , Akihiro Hosokawa
- 申请人: Yoshiaki Tanase , Makoto Inagawa , Akihiro Hosokawa
- 主分类号: C23C14/32
- IPC分类号: C23C14/32 ; C23C14/00
摘要:
A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.
公开/授权文献
- US08182661B2 Controllable target cooling 公开/授权日:2012-05-22
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