Target Cooling Through Gun Drilled Holes
    1.
    发明申请
    Target Cooling Through Gun Drilled Holes 审中-公开
    目标通过枪钻孔冷却

    公开(公告)号:US20120175250A1

    公开(公告)日:2012-07-12

    申请号:US13420996

    申请日:2012-03-15

    IPC分类号: C23C14/34 B23P11/00

    摘要: A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.

    摘要翻译: 特别适用于具有密封于主处理室的目标组件和容纳移动磁控管的真空抽吸室的大型面板等离子体溅射反应器的溅射靶组件。 目标瓦片被粘合到的目标组件包括具有平行于主面钻出的平行冷却孔的整体板。 孔的端部可以是密封的,并且垂直延伸的槽在每侧上布置成两个交错的组,并且被成对地加工成在背板的相对侧上的相应的一对冷却孔。 四个歧管管被密封到四组槽,并提供反向流动的冷却剂路径。

    Target cooling through gun drilled holes

    公开(公告)号:US10294559B2

    公开(公告)日:2019-05-21

    申请号:US13420996

    申请日:2012-03-15

    IPC分类号: C23C14/34 H01J37/34

    摘要: A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.

    Controllable target cooling
    3.
    发明授权
    Controllable target cooling 有权
    可控制目标冷却

    公开(公告)号:US08182661B2

    公开(公告)日:2012-05-22

    申请号:US11190389

    申请日:2005-07-27

    IPC分类号: C23C14/34

    摘要: A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.

    摘要翻译: 特别适用于具有密封于主处理室的目标组件和容纳移动磁控管的真空抽吸室的大型等离子体溅射反应器的溅射靶组件。 目标瓦片被粘合到的目标组件包括具有平行于主面钻出的平行冷却孔的整体板。 孔的端部可以是密封的,并且垂直延伸的槽在每侧上布置成两个交错的组,并且被成对地加工成在背板的相对侧上的相应的一对冷却孔。 四个歧管管被密封到四组槽,并提供反向流动的冷却剂路径。

    Controllable target cooling
    4.
    发明申请
    Controllable target cooling 有权
    可控制目标冷却

    公开(公告)号:US20070023275A1

    公开(公告)日:2007-02-01

    申请号:US11190389

    申请日:2005-07-27

    IPC分类号: C23C14/32 C23C14/00

    摘要: A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.

    摘要翻译: 特别适用于具有密封于主处理室的目标组件和容纳移动磁控管的真空抽吸室的大型面板等离子体溅射反应器的溅射靶组件。 目标瓦片被粘合到的目标组件包括具有平行于主面钻出的平行冷却孔的整体板。 孔的端部可以是密封的,并且垂直延伸的槽在每侧上布置成两个交错的组,并且被成对地加工成在背板的相对侧上的相应的一对冷却孔。 四个歧管管被密封到四组槽,并提供反向流动的冷却剂路径。

    Ganged scanning of multiple magnetrons, especially two level folded magnetrons
    5.
    发明授权
    Ganged scanning of multiple magnetrons, especially two level folded magnetrons 有权
    组合扫描多个磁控管,特别是两个级别的磁控管

    公开(公告)号:US08961756B2

    公开(公告)日:2015-02-24

    申请号:US11780757

    申请日:2007-07-20

    IPC分类号: C23C14/35 H01J37/34

    CPC分类号: H01J37/3408 H01J37/3455

    摘要: A magnetron assembly including one or more magnetrons each forming a closed plasma loop on the sputtering face of the target. The target may include multiple strip targets on which respective strip magnetrons roll and are partially supported on a common support plate through a spring mechanism. The strip magnetron may be a two-level folded magnetron in which each magnetron forms a folded plasma loop extending between lateral sides of the strip target and its ends meet in the middle of the target. The magnets forming the magnetron may be arranged in a pattern having generally uniform straight portions joined by curved portion in which extra magnet positions are available near the corners to steer the plasma track. Multiple magnetrons, possibly flexible, may be resiliently supported on a scanned support plate and individually partially supported by rollers on the back of one or more targets.

    摘要翻译: 磁控管组件包括一个或多个磁控管,每个磁控管在靶的溅射面上形成封闭的等离子体环。 目标可以包括多个条带目标,相应的带状磁控管在其上滚动并且通过弹簧机构部分地支撑在公共支撑板上。 带状磁控管可以是两级折叠​​磁控管,其中每个磁控管形成在条带靶的侧面之间延伸的折叠等离子体环,并且其端部在目标的中间相遇。 形成磁控管的磁体可以布置成具有通过弯曲部分连接的具有大致均匀的直线部分的图案,其中在角附近提供额外的磁体位置以引导等离子体轨道。 多个可能是柔性的磁控管可以弹性地支撑在扫描的支撑板上,并且单独部分地由一个或多个靶的背面上的辊支撑。

    Heating and cooling of substrate support
    6.
    发明授权
    Heating and cooling of substrate support 有权
    加热和冷却衬底支架

    公开(公告)号:US07429718B2

    公开(公告)日:2008-09-30

    申请号:US11213348

    申请日:2005-08-24

    IPC分类号: H05B3/68 C23C16/00

    CPC分类号: H01L21/67109

    摘要: A substrate support assembly and method for controlling the temperature of a substrate within a process chamber are provided. A substrate support assembly includes an thermally conductive body comprising a stainless steel material, a substrate support surface on the surface of the thermally conductive body and adapted to support a large area substrate thereon, one or more heating elements embedded within the thermally conductive body, a cooling plate positioned below the thermally conductive body, a base support structure comprising a stainless steel material, positioned below the cooling plate and adapted to structurally support the thermally conductive body, and one or more cooling channels adapted to be supported by the base support structure and positioned between the cooling plate and the base support structure. A process chamber comprising the substrate support assembly of the invention is also provided.

    摘要翻译: 提供了用于控制处理室内的衬底的温度的衬底支撑组件和方法。 衬底支撑组件包括导热体,其包括不锈钢材料,在导热体表面上的衬底支撑表面,并且适于在其上支撑大面积衬底,一个或多个嵌入导热体内的加热元件, 位于所述导热体下方的冷却板,包括位于所述冷却板下方并适于结构地支撑所述导热体的不锈钢材料的基座支撑结构,以及适于由所述基座支撑结构支撑的一个或多个冷却通道,以及 位于冷却板和基座支撑结构之间。 还提供了包括本发明的基板支撑组件的处理室。

    COOLED ANODES
    7.
    发明申请
    COOLED ANODES 审中-公开
    冷却阳极

    公开(公告)号:US20080011601A1

    公开(公告)日:2008-01-17

    申请号:US11771366

    申请日:2007-06-29

    IPC分类号: C23C14/35

    摘要: A physical vapor deposition (PVD) apparatus and a PVD method are disclosed. Extending an anode across the processing space between the target and the substrate may increase deposition uniformity on a substrate. The anode provides a path to ground for electrons that are excited in the plasma and may uniformly distribute the electrons within the plasma across the processing space rather than collect at the chamber walls. The uniform distribution of the electrons within the plasma may create a uniform deposition of material on the substrate. The anodes may be cooled with a cooling fluid to control the temperature of the anodes and reduce flaking. The anodes may be disposed across the process space perpendicular to the long side of a magnetron that may scan in two dimensions across the back of the sputtering target. The scanning magnetron may reduce localized heating of the anode.

    摘要翻译: 公开了物理气相沉积(PVD)装置和PVD方法。 将阳极延伸穿过靶和衬底之间的处理空间可增加衬底上的沉积均匀性。 阳极为在等离子体中被激发的电子提供到地面的路径,并且可以将等离子体内的电子均匀地分布在处理空间中,而不是在室壁处收集。 电子在等离子体内的均匀分布可能会在衬底上产生均匀的材料沉积。 阳极可以用冷却流体冷却以控制阳极的温度并减少剥落。 阳极可以跨过垂直于磁控管的长边的处理空间,其可以跨过溅射靶的背面的二维扫描。 扫描磁控管可以减少阳极的局部加热。

    Partially suspended rolling magnetron
    9.
    发明授权
    Partially suspended rolling magnetron 有权
    部分悬浮磁控管

    公开(公告)号:US07879210B2

    公开(公告)日:2011-02-01

    申请号:US11347667

    申请日:2006-02-03

    IPC分类号: C23C14/35

    摘要: A magnetron scanning and support mechanism in which the magnetron is partially supported from an overhead scanning mechanism through multiple springs coupled to different horizontal locations on the magnetron and partially supported from below at multiple locations on the target, on which it slides or rolls. In one embodiment, the yoke plate is continuous and uniform. In another embodiment, the magnetron's magnetic yoke is divided into two flexible yokes, for example, of complementary serpentine shape and each supporting magnets of respective polarity. The yokes separated by a gap sufficiently small that the two yokes are magnetically coupled. Each yoke has its own set of spring supports from above and rolling/sliding supports from below to allow the magnetron shape to conform to that of the target. Alternatively, narrow slots are formed in a unitary yoke.

    摘要翻译: 一种磁控管扫描和支撑机构,其中磁控管通过耦合到磁控管上的不同水平位置的多个弹簧部分地从顶部扫描机构支撑,并且在靶上的多个位置处从其下方部分地支撑,在其上滑动或滚动。 在一个实施例中,轭板是连续且均匀的。 在另一个实施例中,磁控管的磁轭被分成两个柔性轭,例如互补的蛇形形状和各个极性的每个支撑磁体。 磁轭分开足够小的间隙,使得两个磁轭磁耦合。 每个轭具有其自己的一组弹簧支撑件,从上方起滚动/滑动支撑件,从而允许磁控管形状与靶材的形状一致。 或者,窄槽形成为单一轭。

    PVD target
    10.
    发明授权
    PVD target 有权
    PVD目标

    公开(公告)号:US07815782B2

    公开(公告)日:2010-10-19

    申请号:US11426271

    申请日:2006-06-23

    IPC分类号: C23C14/35

    摘要: A physical vapor deposition target assembly is configured to isolate a target-bonding layer from a processing region. In one embodiment, the target assembly comprises a backing plate, a target having a first surface and a second surface, and a bonding layer disposed between the backing plate and the second surface. The first surface of the target is in fluid contact with a processing region and the second surface of the target is oriented toward the backing plate. The target assembly may include multiple targets.

    摘要翻译: 物理气相沉积靶组件被配置为将目标结合层与处理区域隔离。 在一个实施例中,目标组件包括背板,具有第一表面和第二表面的靶,以及设置在背板和第二表面之间的结合层。 目标的第一表面与处理区域流体接触,并且目标物的第二表面朝向背板取向。 目标组件可以包括多个目标。