发明申请
- 专利标题： Thin film conductor and method of fabrication
- 专利标题（中）： 薄膜导体和制造方法
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申请号： US11502918申请日： 2006-08-11
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公开(公告)号： US20070034954A1公开(公告)日： 2007-02-15
- 发明人: Beom-seok Cho , Je-hun Lee , Chang-oh Jeong , Yang-ho Bae
- 申请人： Beom-seok Cho , Je-hun Lee , Chang-oh Jeong , Yang-ho Bae
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 优先权： KR10-2005-0074455 20050812
- 主分类号： H01L27/12
- IPC分类号： H01L27/12
摘要：
A thin film conductor having improved adhesion and superior conductivity, a method for fabricating the same, a thin film transistor (TFT) plate including the thin film conductor, and a method for fabricating the TFT plate are provided. The thin film conductor includes an adhesive layer containing an oxidation-reactive metal or silicidation-reactive metal and silver, a silver conductive layer formed on the adhesive layer, and a protection layer formed on the silver conductive layer and containing an oxidation-reactive metal and silver.
公开/授权文献
- US07808108B2 Thin film conductor and method of fabrication 公开/授权日：2010-10-05
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