发明申请
- 专利标题： Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same
- 专利标题（中）： 包括三维堆叠的多个半导体芯片的半导体器件及其制造方法
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申请号： US11503129申请日： 2006-08-14
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公开(公告)号： US20070045864A1公开(公告)日： 2007-03-01
- 发明人: Hiroshi Shiba , Makoto Segawa
- 申请人： Hiroshi Shiba , Makoto Segawa
- 优先权： JP2005-241427 20050823
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A semiconductor device includes a package substrate having a chip mounting surface with at least a plurality of first substrate-side pads and a plurality of second substrate-side pads, a rectangular first semiconductor chip having a first main surface fixed on the chip mounting surface, a plurality of first bonding wires through which a plurality of first pads arranged along one side of a second main surface of the first semiconductor chip and the first substrate-side pads are bonded to each other, a rectangular second semiconductor chip having a third main surface fixed on the second main surface, and a plurality of second bonding wires through which a plurality of second pads arranged along one side of a fourth main surface of the second semiconductor chip and the second substrate-side pads are bonded to each other.
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