摘要:
A semiconductor device includes a package substrate having a chip mounting surface with at least a plurality of first substrate-side pads and a plurality of second substrate-side pads, a rectangular first semiconductor chip having a first main surface fixed on the chip mounting surface, a plurality of first bonding wires through which a plurality of first pads arranged along one side of a second main surface of the first semiconductor chip and the first substrate-side pads are bonded to each other, a rectangular second semiconductor chip having a third main surface fixed on the second main surface, and a plurality of second bonding wires through which a plurality of second pads arranged along one side of a fourth main surface of the second semiconductor chip and the second substrate-side pads are bonded to each other.
摘要:
A control system for an internal combustion engine having a plurality of cylinders and a switching mechanism for switching between an all-cylinder operation in which all of the plurality of cylinders are operated and a partial-cylinder operation in which at least one of the plurality of cylinders is halted. A condition for performing the partial-cylinder operation is determined, based on the detected operating parameters of the vehicle driven by the engine. A result of the determination is modified so that the partial-cylinder operation may be continued, when the detected operating parameters satisfy a predetermined continuation condition within a predetermined time period from the time a vehicle operating state where the condition for performing the partial-cylinder operation is satisfied, has changed to another vehicle operating state where the condition for performing the partial-cylinder operation is not satisfied.
摘要:
A BiCMOS circuit includes a CMOS circuit for inverting data applied to an input terminal and a first bipolar transistor, having a base connected to an output point of this CMOS circuit, a collector connected to a power supply voltage and an emitter connected to an output terminal, for charging the output terminal. The BiCMOS circuit also includes a second bipolar transistor, having a collector connected to the output terminal, for discharging the output terminal, a first MOS transistor of a first conductivity type connected in parallel between the base and the collector of the second bipolar transistor and a second MOS transistor of the first conductivity type connected in series with the first MOS transistor and having a gate connected to an output point of the CMOS circuit. The Bi-CMOS circuit further includes a third MOS transistor of the first conductivity type connected between the input terminal and the gate of the first MOS transistor of the first conductivity type and having a gate receiving a first reference voltage, and a fourth MOS transistor of a second conductivity type connected between the first reference voltage and the gate of the first MOS transistor. A large variation width of an output voltage can be ensured, and hence the Bi-CMOS circuit normally operates even at a low voltage without any deterioration in terms of delay time.
摘要:
A memory cell array includes static memory cells arranged in an array of n rows.times.m columns. Each of the memory cells includes MOS transistors formed in a semicondutor substrate and in a corresponding one of well regions of the conductivity type opposite to that of the semiconductor substrate. The well regions are independently formed for each row or for every two or more rows of the memory cell array. The well regions are connected to the respective sources of MOS transistors formed in the well regions. The source and backgate of each of the MOS transistors formed in the well regions are connected to the common source wirings for each of the independently formed well regions. Isolation circuits are respectively connected between the common source wirings for the repective well regions and the power source. A row of the memory cell array to which a defective memory cell is connected is isolated from the power source by means of the isolation circuits.
摘要:
An integrated circuit serving as an E/D type inverter circuit and provided with a gate-protection circuit. The inverter circuit is constructed of an E type MOSFET having a gate coupled to an input signal and a D type MOSFET which operates as load, and the gate-protective circuit is constructed by a MOSFET which is connected between a power supply and the D type MOSFET and whose gate is connected to the power supply. The gate of the D type MOSFET is protected by the gate-protection circuit even if noise exists on the power supply line.
摘要:
A semiconductor circuit has a static bootstrap circuit, which includes a first MOS transistor with an input signal supplied to the gate and having the current path connected between a voltage source terminal and a node, a second MOS transistor having the gate connected to receive an inverted form of the input signal after a delay time and having the current path connected between the node and a reference potential terminal and a capacitor connected between the gate of the first MOS transistor and the node. The semiconductor circuit also has a short pulse generator. The bootstrap circuit further includes a third MOS transistor having the current path connected between the output terminal of the short pulse generator and the node and with the input signal supplied to the gate and fourth and fifth MOS transistors having the respective gates connected to the gates of the first and second MOS transistors and the respective current paths connected in series between the voltage source terminal and reference potential terminal.
摘要:
A semiconductor device having a semiconductor substrate, wherein first and second insulating gate FET transistor connected respectively in series with first and second polycrystalline silicon layers acting as loads of first and second inverters are formed. The first polycrystalline silicon layer is provided above the drain of the first insulation gate FET transistor, and the second polycrystalline silicon layer is provided above the drain of the second insulation gate FET transistor.
摘要:
A valve train for an internal combustion engine including a plurality of cylinders having different valve mechanism constructions, in which the valve train has a correcting member for correcting a difference in valve lift amount that is produced between the plurality of cylinders due to a difference in construction between valve mechanisms so as to make valve lift amounts of the plurality of cylinders substantially uniform.
摘要:
A semiconductor device has an internal circuit (2), a PAD, a NMOS Tr (QN) as a protective transistor formed between a node (N) on a signal line and a first power source (Vss), and a NOR gate (G1) as a logical gate connected to a gate as a control terminal of the NMOS transistor (QN). The internal circuit (2) is connected to the PAD through the signal line. The NOR gate (G1) keeps the protective transistor (QN) an OFF state during a normal operation of the internal circuit (2). In addition, the semiconductor device further includes a test circuit (21). The output from the NOR gate (G1), whose one input is the output from the test circuit (21), is supplied to the gate of the NMOS transistor (QN). The output from the test circuit (21) is thereby output to outside through the NMOS transistor (QN) and the PAD.
摘要:
A semiconductor device comprises: a first circuit (11) formed in a first well (N-type) and a second well (P-type) of a semiconductor substrate, supplied with a first supply voltage (V.sub.ss) and a second supply voltage (V.sub.cc) higher than the first supply voltage, and activated when a first well bias voltage (V.sub.BP1) is applied to the first well (N-type) and a second well bias voltage (V.sub.BN1) is applied to the second well (P-type); a second circuit (201; 202) formed in a third well (N-type) and a fourth well (P-type) of the same semiconductor substrate as above, supplied with the first supply voltage (V.sub.ss) and a third supply voltage (V.sub.cc2) higher than the first supply voltage but different from the second supply voltage (V.sub.cc), and activated when a third well bias voltage (V.sub.BP2) is applied to the third well (N-type) and a fourth well bias voltage (V.sub.BN2) is applied to the fourth well (P-type); a first bias circuit (20) supplied with the first and second supply voltages (V.sub.ss and V.sub.cc), for generating and outputting the first well bias voltage (V.sub.BP1); a second bias circuit (21) supplied with the first and second supply voltages (V.sub.ss and V.sub.cc), for generating and outputting the second well bias voltage (V.sub.BN1); a third bias circuit (16) supplied with the first and third supply voltages (V.sub.ss and V.sub.cc2) for generating and outputting the third well bias voltage (V.sub.BP2); and a fourth bias circuit (17) supplied with the first and third supply voltages (V.sub.ss and V.sub.cc2) for generating and outputting the fourth well bias voltage (V.sub.BN2). In the semiconductor device, even if any of the second supply voltage (V.sub.cc) and the third supply voltage (V.sub.cc2) is first supplied, it is possible to prevent the latch-up phenomenon caused by the floated substrate potential.