发明申请
US20070048145A1 Vacuum evacuation device and method, and substrate processing apparatus and method
审中-公开
真空抽气装置及方法,以及基板处理装置及方法
- 专利标题: Vacuum evacuation device and method, and substrate processing apparatus and method
- 专利标题(中): 真空抽气装置及方法,以及基板处理装置及方法
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申请号: US11501793申请日: 2006-08-10
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公开(公告)号: US20070048145A1公开(公告)日: 2007-03-01
- 发明人: Katsutoshi Ishii , Ken Nakao , Takanobu Asano , Kota Umezawa , Hiroaki Ogamino , Tadashi Urata , Katsuaki Usui , Masafumi Inoue , Shinichi Sekiguchi , Hironobu Yamasaki
- 申请人: Katsutoshi Ishii , Ken Nakao , Takanobu Asano , Kota Umezawa , Hiroaki Ogamino , Tadashi Urata , Katsuaki Usui , Masafumi Inoue , Shinichi Sekiguchi , Hironobu Yamasaki
- 优先权: JP2005-234236 20050812; JP2006-201030 20060724
- 主分类号: F04B49/06
- IPC分类号: F04B49/06
摘要:
A vacuum evacuation device 2 of the invention comprises a vacuum pump 4,5 for exhausting a gas G2 in a process chamber 21 into which a process gas G1 is introduced and in which a process reaction is performed, to form a vacuum in said process chamber 21; and a control means 6 for performing a first control that regulates the rotational speed of said vacuum pump 4,5 such that a pressure condition in said process chamber 21 reaches a pressure condition suitable for said process reaction during said process reaction, wherein said control means 6 calculates a specified rotational speed for said vacuum pump 4,5 based on process information related to said process reaction, and performs a second control that brings said vacuum pump 4,5 to said specified rotational speed before said first control. The vacuum evacuation device 2 is capable of bringing the pressure in a process chamber 21 to the target pressure in a short period without a vacuum pump 4,5 being overloaded, regardless of the process reaction condition.
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