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22 条记录 (耗时 0.034 秒)

    Vacuum evacuation device and method, and substrate processing apparatus and method
    1.
    发明申请
    Vacuum evacuation device and method, and substrate processing apparatus and method 审中-公开
    真空抽气装置及方法，以及基板处理装置及方法

    公开(公告)号：US20070048145A1

    公开(公告)日：2007-03-01

    申请号：US11501793

    申请日：2006-08-10

    申请人： Katsutoshi Ishii ,  Ken Nakao ,  Takanobu Asano ,  Kota Umezawa ,  Hiroaki Ogamino ,  Tadashi Urata ,  Katsuaki Usui ,  Masafumi Inoue ,  Shinichi Sekiguchi ,  Hironobu Yamasaki

    发明人： Katsutoshi Ishii ,  Ken Nakao ,  Takanobu Asano ,  Kota Umezawa ,  Hiroaki Ogamino ,  Tadashi Urata ,  Katsuaki Usui ,  Masafumi Inoue ,  Shinichi Sekiguchi ,  Hironobu Yamasaki

    IPC分类号： F04B49/06

    CPC分类号： F04D19/042 ,  F04D27/0261

    摘要： A vacuum evacuation device 2 of the invention comprises a vacuum pump 4,5 for exhausting a gas G2 in a process chamber 21 into which a process gas G1 is introduced and in which a process reaction is performed, to form a vacuum in said process chamber 21; and a control means 6 for performing a first control that regulates the rotational speed of said vacuum pump 4,5 such that a pressure condition in said process chamber 21 reaches a pressure condition suitable for said process reaction during said process reaction, wherein said control means 6 calculates a specified rotational speed for said vacuum pump 4,5 based on process information related to said process reaction, and performs a second control that brings said vacuum pump 4,5 to said specified rotational speed before said first control. The vacuum evacuation device 2 is capable of bringing the pressure in a process chamber 21 to the target pressure in a short period without a vacuum pump 4,5 being overloaded, regardless of the process reaction condition.

    摘要翻译： 本发明的真空排气装置2包括：真空泵4,5，用于在处理室21中排出气体G 2，工艺气体G 1引入到该气体G 2中并进行处理反应，以在所述 处理室21; 以及用于执行调节所述真空泵4,5的转速的第一控制的控制装置6，使得所述处理室21中的压力条件达到在所述处理反应期间适用于所述处理反应的压力条件，其中所述控制装置 图6基于与所述处理反应相关的处理信息计算出所述真空泵4,5的指定转速，并且执行使所述真空泵4,5在所述第一控制之前达到所述指定转速的第二控制。 真空排气装置2能够在不使真空泵4,5过载的情况下在短时间内将处理室21内的压力提高到目标压力，而与过程反应条件无关。

    Heat treatment system and method
    2.
    发明授权
    Heat treatment system and method 有权
    热处理系统及方法

    公开(公告)号：US06540509B2

    公开(公告)日：2003-04-01

    申请号：US09867564

    申请日：2001-05-31

    申请人： Takanobu Asano ,  Katsutoshi Ishii ,  Hiroyuki Yamamoto ,  George Hoshi ,  Kazutoshi Miura

    发明人： Takanobu Asano ,  Katsutoshi Ishii ,  Hiroyuki Yamamoto ,  George Hoshi ,  Kazutoshi Miura

    IPC分类号： F27B500

    CPC分类号： C23C16/45561 ,  C23C16/401 ,  C23C16/452 ,  C23C16/4557 ,  C30B33/005 ,  H01L21/67109

    摘要： The present invention relates generally to a heat treatment system and method for heat-treating an object to be treated. Particularly, the invention relates to a heat treatment system wherein an object to be treated is carried in a reaction vessel, which has been pressure-reduced to a predetermined degree of vacuum and the interior of which is heated to a predetermined process temperature, and a process gas is supplied into the reaction vessel via a gas feed passage to process the object.

    摘要翻译： 本发明一般涉及用于对待处理物体进行热处理的热处理系统和方法。 特别地，本发明涉及一种热处理系统，其中待处理物体被运送在反应容器中，该反应容器被减压至预定的真空度并将其内部加热到预定的工艺温度，并且 处理气体经由供气通道供给到反应容器中以处理物体。

    Dry air-supplying apparatus and treating apparatus
    5.
    发明申请
    Dry air-supplying apparatus and treating apparatus 失效
    干燥供气装置和处理装置

    公开(公告)号：US20050246918A1

    公开(公告)日：2005-11-10

    申请号：US10528230

    申请日：2003-09-19

    申请人： Takashi Tanahashi ,  Takanobu Asano ,  Ken Nakao ,  Katsuhiro Yamashita

    发明人： Takashi Tanahashi ,  Takanobu Asano ,  Ken Nakao ,  Katsuhiro Yamashita

    IPC分类号： B01D53/06 ,  B01D53/26 ,  F24F3/14 ,  F26B21/06 ,  F26B3/00

    CPC分类号： F24F3/1423 ,  B01D53/06 ,  B01D53/261 ,  B01D2253/108 ,  B01D2253/25 ,  B01D2253/3425 ,  B01D2257/70 ,  B01D2257/80 ,  B01D2259/40007 ,  B01D2259/40052 ,  B01D2259/4009 ,  F24F2203/1032 ,  F24F2203/1056 ,  F24F2203/1072 ,  F24F2203/1084 ,  F24F2203/1088 ,  F24F2203/1096

    摘要： Two rotors 18a, 18b each housing a honeycomb structure 25 carrying an absorbent is driven for rotation by a common motor 19. Partitioning members 17 define an absorbing zone S and a recovery zone U in the rotor depending on the angular positional relationship between the partitioning members 17 and the rotor corresponding thereto. In the absorbing zone S, the absorbent removes moisture and organic matters from air passing therethrough. In the recovery zone U, recovery of the absorbent deteriorated by absorbing the moisture and the organic matters is preformed by using heated dry air. Air sucked from a transfer space 10 of the processing system sequentially passes through the absorbing zones of both the rotors via a circulation passage 20, thereafter returned to the transfer space. A part of clean dry air having passed through the absorbing zones of both the rotors is supplied into an exhaust passage 21, and is heated by a heater, and passes through the recovery zones of both the rotors.

    摘要翻译： 每个容纳携带吸收剂的蜂窝结构25的两个转子18a，18b被驱动以便由公共电动机19旋转。 分隔构件17根据分隔构件17和与其对应的转子之间的角度位置关系来限定转子中的吸收区域S和恢复区域U. 在吸收区S中，吸收剂从通过其的空气中除去水分和有机物质。 在回收区U中，通过吸收水分和有机物而劣化的吸收剂的回收通过使用加热的干燥空气来预处理。 从处理系统的传送空间10吸入的空气经由循环通道20依次通过两个转子的吸收区，然后返回到传送空间。 已经通过两个转子的吸收区的清洁干燥空气的一部分被供给到排气通道21中，并被加热器加热，并且通过两个转子的回收区。

    Dry air-supplying apparatus and treating apparatus
    6.
    发明授权
    Dry air-supplying apparatus and treating apparatus 失效
    干燥供气装置和处理装置

    公开(公告)号：US07207123B2

    公开(公告)日：2007-04-24

    申请号：US10528230

    申请日：2003-09-19

    申请人： Takashi Tanahashi ,  Takanobu Asano ,  Ken Nakao ,  Katsuhiro Yamashita

    发明人： Takashi Tanahashi ,  Takanobu Asano ,  Ken Nakao ,  Katsuhiro Yamashita

    IPC分类号： F26B21/06

    CPC分类号： F24F3/1423 ,  B01D53/06 ,  B01D53/261 ,  B01D2253/108 ,  B01D2253/25 ,  B01D2253/3425 ,  B01D2257/70 ,  B01D2257/80 ,  B01D2259/40007 ,  B01D2259/40052 ,  B01D2259/4009 ,  F24F2203/1032 ,  F24F2203/1056 ,  F24F2203/1072 ,  F24F2203/1084 ,  F24F2203/1088 ,  F24F2203/1096

    摘要： Two rotors 18a, 18b each housing a honeycomb structure 25 carrying an absorbent is driven for rotation by a common motor 19. Partitioning members 17 define an absorbing zone S and a recovery zone U in the rotor depending on the angular positional relationship between the partitioning members 17 and the rotor corresponding thereto. In the absorbing zone S, the absorbent removes moisture and organic matters from air passing therethrough. In the recovery zone U, recovery of the absorbent deteriorated by absorbing the moisture and the organic matters is preformed by using heated dry air. Air sucked from a transfer space 10 of the processing system sequentially passes through the absorbing zones of both the rotors via a circulation passage 20, thereafter returned to the transfer space. A part of clean dry air having passed through the absorbing zones of both the rotors is supplied into an exhaust passage 21, and is heated by a heater, and passes through the recovery zones of both the rotors.

    摘要翻译： 每个容纳携带吸收剂的蜂窝结构25的两个转子18a，18b被驱动以便由公共电动机19旋转。 分隔构件17根据分隔构件17和与其对应的转子之间的角度位置关系来限定转子中的吸收区域S和恢复区域U. 在吸收区S中，吸收剂从通过其的空气中除去水分和有机物质。 在回收区U中，通过吸收水分和有机物而劣化的吸收剂的回收通过使用加热的干燥空气来预处理。 从处理系统的传送空间10吸入的空气经由循环通道20依次通过两个转子的吸收区，然后返回到传送空间。 已经通过两个转子的吸收区的清洁干燥空气的一部分被供给到排气通道21中，并被加热器加热，并且通过两个转子的回收区。

    Thermal processing apparatus and a thermal processing method
    8.
    发明申请
    Thermal processing apparatus and a thermal processing method 审中-公开
    热处理装置和热处理方法

    公开(公告)号：US20050121142A1

    公开(公告)日：2005-06-09

    申请号：US10960762

    申请日：2004-10-08

    申请人： Ken Nakao ,  Takanobu Asano ,  Hiroki Fukushima ,  Katsuya Okumura

    发明人： Ken Nakao ,  Takanobu Asano ,  Hiroki Fukushima ,  Katsuya Okumura

    IPC分类号： H01L21/31 ,  C23C16/02 ,  H01L21/00 ,  H01L21/205 ,  H01L21/304 ,  H01L21/324 ,  C23F1/00

    CPC分类号： H01L21/67109 ,  C23C16/0227 ,  H01L21/67057

    摘要： Substrates having surfaces in a highly clean condition are subjected to a thermal process in a heating furnace. In a thermal processing apparatus for processing substrates by a predetermined thermal process that heats the substrates by a heating means, the substrates are held in a vertical position at horizontal intervals in a reaction vessel. Cleaning liquids are supplied into the reaction vessel to clean the substrates, and then the cleaning liquids are drained away through a drain port, and then a process gas is supplied into the reaction vessel to process the substrates by a thermal process. The substrates having the cleaned clean surfaces are subjected to the thermal process without being exposed to the ambient atmosphere and can be satisfactorily processed by the thermal process.

    摘要翻译： 具有高度干燥状态的表面的基板在加热炉中进行热处理。 在用于通过加热装置加热基板的预定热处理来处理基板的热处理装置中，基板在反应容器中以水平间隔保持在垂直位置。 向反应容器内供给清洗液以清洗基板，然后将清洗液通过排水口排出，然后通过热处理将工艺气体供给到反应容器中以处理基板。 具有清洁的清洁表面的基板经受热处理而不暴露于环境大气中，并且可以通过热处理令人满意地加工。

    Vertical heat-treatment apparatus having a wafer transfer mechanism
    9.
    发明授权
    Vertical heat-treatment apparatus having a wafer transfer mechanism 失效
    具有晶片传送机构的立式热处理装置

    公开(公告)号：US5110248A

    公开(公告)日：1992-05-05

    申请号：US550981

    申请日：1990-07-11

    申请人： Takanobu Asano ,  Hirofumi Kitayama ,  Hiroyuki Iwai ,  Yuuji Ono

    发明人： Takanobu Asano ,  Hirofumi Kitayama ,  Hiroyuki Iwai ,  Yuuji Ono

    IPC分类号： H01L21/00 ,  H01L21/677

    CPC分类号： H01L21/67115 ,  H01L21/67781

    摘要： A vertical heat-treatment apparatus is provided with a mechanism for automatically transferring semiconductor wafers from carriers to a boat for a vertical type furnace. The automatic transferring mechanism comprises a port for receiving a plurality of carriers arranged in series in an upright state, a posture change mechanism for changing the posture of wafers in the carriers from the upright state to the horizontal state, a parallel transfer mechanism for transferring the carriers on the boat to the posture change mechanism, a carrier loading/unloading mechanism for loading the carriers on a station, a wafer loading/unloading mechanism for taking out the wafers from the carriers on the station in turn and transferring the taken-out wafers to the boat in turn, and a mounting mechanism for mounting the boat in the furnace. The carrier loading/unloading mechanism and the wafer loading/unloading mechanism are mounted on a common frame and are rotated and lifted at the same time.

    摘要翻译： 立式热处理装置设置有用于将半导体晶片从载体自动转移到垂直型炉的船的机构。 自动转印机构包括用于接收以直立状态串联布置的多个载体的端口，用于将载体中的晶片的姿势从直立状态改变为水平状态的姿势改变机构，用于传送 船上的载体到姿势改变机构，用于将载体载载在车站上的载体装载/卸载机构，用于依次从车站上的载体取出晶片的晶片装载/卸载机构，并传送取出的晶片 依次转到船上，以及用于将船安装在炉中的安装机构。 载体装载/卸载机构和晶片装载/卸载机构安装在公共框架上并同时旋转和提升。

    Treatment apparatus
    10.
    发明授权
    Treatment apparatus 失效
    治疗仪器

    公开(公告)号：US5562383A

    公开(公告)日：1996-10-08

    申请号：US583669

    申请日：1996-01-05

    申请人： Hiroyuki Iwai ,  Tamotsu Tanifuji ,  Takanobu Asano ,  Ryoichi Okura

    发明人： Hiroyuki Iwai ,  Tamotsu Tanifuji ,  Takanobu Asano ,  Ryoichi Okura

    IPC分类号： H01L21/304 ,  H01L21/677 ,  H01L21/00

    CPC分类号： H01L21/67769 ,  H01L21/67772 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

    摘要： A treatment apparatus comprises a treatment chamber for performing a treatment for a workpiece W, a loading chamber connected to the treatment chamber, for loading and unloading a holding member which contains the workpiece into and from the treatment chamber, and an input/output chamber for inputting and outputting the workpiece to and from the loading chamber. The input/output chamber includes a cassette accommodating vessel port which holds a cassette accommodating vessel. The vessel is filled with clean air or an inert gas, and is airtightly closed. A cassette receiving mechanism is disposed below the port and lowers only the cassette of the vessel so as to receive the cassette. Thus, when the cassette is input and output to and from the outside of the treatment apparatus, the workpiece contained within the cassette is not exposed to the atmosphere in a working region. Consequently, it is not necessary to improve the cleanliness level of the atmosphere in the working region. As a result, the construction cost of the clean room and the operation cost thereof can be reduced. A clean air blowing device is disposed below the port. The clean air blowing device blows a side flow of clean air. Thus, the atmosphere at a position below the port where air tends to stay is circulated. Thus, since the surface of the workpiece loaded in the treatment chamber is exposed to the side flow, particles and the like that adhere thereto are purged.

    摘要翻译： 处理装置包括：处理室，用于对工件W进行处理，连接到处理室的装载室，用于将包含工件的保持构件装载到处理室和从处理室中卸载;以及输入/输出室， 将工件输入和输出到装载室。 输入/输出室包括容纳容纳容器的盒式磁带容纳容器端口。 容器内装有清洁空气或惰性气体，并且气密地关闭。 盒接收机构设置在端口下方，并且仅降低容器的盒以便接收盒。 因此，当盒子从处理设备的外部输入和输出时，包含在盒内的工件不会暴露在工作区域中的大气中。 因此，不需要提高工作区域的气氛的清洁度。 因此，能够降低洁净室的建筑成本及其运转成本。 清洁吹风装置设置在端口下方。 清洁吹风装置吹扫清洁空气的侧流。 因此，空气倾向于停留的港口下方的气氛被循环。 因此，由于装载在处理室中的工件的表面暴露于侧流，所以清除附着在其上的颗粒等。