发明申请
- 专利标题： Interconnect structures with encasing cap and methods of making thereof
- 专利标题（中）： 具有封盖的互连结构及其制造方法
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申请号： US11503259申请日： 2006-08-14
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公开(公告)号： US20070054489A1公开(公告)日： 2007-03-08
- 发明人: Kwong Wong , Louis Hsu , Timothy Dalton , Carl Radens , Chih-Chao Yang , Lawrence Clevenger , Theodorus Standaert
- 申请人： Kwong Wong , Louis Hsu , Timothy Dalton , Carl Radens , Chih-Chao Yang , Lawrence Clevenger , Theodorus Standaert
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method of making an interconnect that includes providing an interconnect structure in a dielectric material, recessing the dielectric material such that a portion of the interconnect structure extends above an upper surface of the dielectric; and depositing an encasing cap over the extended portion of the interconnect structure.