A plurality of acoustic wave sensing devices can be provided, which are mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate is appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of torque SAW sensing resonators can then be located upon the quartz wafer substrate, which is based upon previously mechanically simulated devices for implementation upon the substrate, together with a quartz cover to thereby produce a quartz torque sensor package from the quartz wafer substrate.