发明申请
- 专利标题: Vacuum processing apparatus
- 专利标题(中): 真空加工设备
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申请号: US11512309申请日: 2006-08-30
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公开(公告)号: US20070068626A1公开(公告)日: 2007-03-29
- 发明人: Michiaki Kobayashi , Tsutomu Nakamura , Takeo Uchino , Akitaka Makino , Masashi Nakagome
- 申请人: Michiaki Kobayashi , Tsutomu Nakamura , Takeo Uchino , Akitaka Makino , Masashi Nakagome
- 优先权: JP2005-283233 20050929
- 主分类号: C23F1/00
- IPC分类号: C23F1/00 ; H01L21/306
摘要:
A plasma processing apparatus which contributes to reducing required time for maintenance and thereby to enhancing the efficiency of processing and that of apparatus operation is to be provided. A vacuum processing apparatus comprises a vacuum vessel in which a substrate-shaped sample is arranged in an internally arranged processing chamber in which the pressure is reduced; a transfer chamber to which the vacuum vessel is linked and through whose inside reduced in pressure the sample is transferred; a passage which establishes communication between the transfer chamber and the vacuum vessel in a state in which the transfer chamber and the processing chamber are linked to each other and through whose inside the sample not yet processed or already processed is transferred; and a covering member which is removably coupled to cover the internal wall face of the passage, wherein the sample is processed within the processing chamber with a plasma formed in the processing chamber.
公开/授权文献
- US08048259B2 Vacuum processing apparatus 公开/授权日:2011-11-01