发明申请
- 专利标题: 3D MMIC VCO and methods of making the same
- 专利标题(中): 3D MMIC VCO和制作方法相同
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申请号: US11236033申请日: 2005-09-27
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公开(公告)号: US20070069824A1公开(公告)日: 2007-03-29
- 发明人: Mark Kintis , Flavia Fong , Thomas Wong , Xing Lan
- 申请人: Mark Kintis , Flavia Fong , Thomas Wong , Xing Lan
- 专利权人: Northrop Grumman Corporation
- 当前专利权人: Northrop Grumman Corporation
- 主分类号: H03K3/03
- IPC分类号: H03K3/03
摘要:
A three dimensional (3D) microwave monolithic integrated circuit (MMIC) multi-push voltage controlled oscillator (VCO) and methods of making the same is provided. The 3D MMIC multi-push oscillator includes a plurality of matching frequency oscillators coupled to a phasing ring in substantially equidistantly spaced apart locations. A combined VCO output signal is provided at a central output connection point of the phasing ring. The central output connection point resides on a first plane. An output conductor transition has a first end coupled to the central output connection point and a second end provided as an output to the quad-push VCO. The output conductor transition extends transverse to the first plane and terminates at a second plane separated from the first plane. The multi-push oscillator can be a push-push, quad-push or N-push type VCO based on a particular implementation.
公开/授权文献
- US07276981B2 3D MMIC VCO and methods of making the same 公开/授权日:2007-10-02
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