公开(公告)号：US20080169846A1

公开(公告)日：2008-07-17

申请号：US11651989

申请日：2007-01-11

申请人： Xing Lan ,  Mark Kintis ,  Flavia S. Fong

发明人： Xing Lan ,  Mark Kintis ,  Flavia S. Fong

IPC分类号： H03B21/00 ,  G06F1/04 ,  H03K7/02

CPC分类号： H03B25/00 ,  H03K5/12

摘要： A device and method are disclosed for synthesizing a waveform having pulse segments. An exemplary generator can include units having a time delay element and pulse generator generating the pulse segments. An input divider divides an input signal into signal instances that propagate through the units and an output combiner combines pulse segments to form the waveform. The pulse generators include a sharpening circuit for sharpening a rising edge and a falling edge of the pulse segments. The sharpening circuit includes a tunable delay element coupled to a non-linear transmission line (NLTL). Another NLTL can be coupled in parallel with the tunable delay element and the first NLTL. The NLTLs include input sections coupled to anodes or cathodes of Schottky diode elements, and the respective cathodes or anodes are coupled to a signal ground.

公开(公告)号：US20070052491A1

公开(公告)日：2007-03-08

申请号：US11218968

申请日：2005-09-02

申请人： Mark Kintis ,  Flavia Fong ,  Xing Lan

发明人： Mark Kintis ,  Flavia Fong ,  Xing Lan

IPC分类号： H03H7/42

CPC分类号： H01P5/10 ,  H01F17/0006 ,  H01F2021/125 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/00

摘要： A three dimensional (3D) monolithic integrated circuit (MMIC) balun and methods of making the same are provided. A primary spiral winding is spaced apart from a secondary primary winding by a gap in a substantially aligned stacked configuration forming a balun. The gap medium can be a low dielectric constant material if employing a multi-metal process or air if employing a wafer level packaging process.

摘要翻译： 提供了三维（3D）单片集成电路（MMIC）平衡 - 不平衡变换器及其制造方法。 初级螺旋绕组与次级初级绕组间隔开一个形成一个平衡 - 不平衡变换器的基本对齐的堆叠结构的间隙。 如果使用多金属工艺或空气，如果采用晶片级封装工艺，间隙介质可以是低介电常数材料。

公开(公告)号：US07068745B2

公开(公告)日：2006-06-27

申请号：US09991500

申请日：2001-11-16

申请人： Mark Kintis ,  Robert R. Harnden ,  Kenneth B. Weber ,  Mark V. Keller ,  Donald L. Lochhead ,  Donald R. Martin

发明人： Mark Kintis ,  Robert R. Harnden ,  Kenneth B. Weber ,  Mark V. Keller ,  Donald L. Lochhead ,  Donald R. Martin

IPC分类号： H04L25/10

CPC分类号： H04L27/2647

摘要： A multi-carrier receiver system and method for receiving a transmission frequency multi-carrier signal include a feedforward cancellation loop. A frequency conversion circuit generates an intermediate frequency (IF) multi-carrier signal based on the transmission frequency multi-carrier signal. The feedforward cancellation loop generates an amplitude corrected multi-carrier signal based on the IF multi-carrier signal such that the amplitude corrected multi-carrier signal has a reduced dynamic range with respect to the IF multi-carrier signal. A primary A/D converter having a significantly lower dynamic range requirements can therefore generate a digital multi-carrier signal based on the amplitude corrected multi-carrier signal. The feedforward cancellation loop therefore enables the primary A/D converter to process multi-carrier signals without the need for large dynamic range requirements.

公开(公告)号：US06888253B1

公开(公告)日：2005-05-03

申请号：US10799062

申请日：2004-03-11

申请人： Harvey Newell Rogers ,  Mark Kintis

发明人： Harvey Newell Rogers ,  Mark Kintis

IPC分类号： H01L23/373 ,  H01L23/48 ,  H01L23/488 ,  H01L23/66

CPC分类号： H01L23/66 ,  H01L23/3735 ,  H01L23/481 ,  H01L23/488 ,  H01L2924/0002 ,  H01L2924/00

摘要： An inexpensive package for a semiconductor chip (1) that incorporates a stress relief buffer (13) between a side of the chip and the metal carrier layer (2) to absorb thermally induced stress produced by significantly different rates of thermal expansion of the wafer and the metal carrier. The buffer (13) is formed by a polymer that is flexible and can be etched, contains a coefficient of thermal expansion that does not significantly differ from that of the chip and/or a combination of CET and elasticity that retains a physical connection with the side of the chip and the metal carrier over the temperature range of operation anticipated for the chip. Polyimide or paraylene are preferred examples. Vias (15) extend through the buffer to place the metal carrier electrically in common with the metal layer (5) found on the back surface of the wafer so that an electrical ground applied to the metal carrier layer (2) may extend through to that surface.

摘要翻译： 一种用于半导体芯片（1）的便宜包装，其包括在芯片的一侧和金属载体层（2）之间的应力消除缓冲器（13），以吸收由晶片的显着不同的热膨胀率产生的热诱导应力;以及 金属载体。 缓冲器（13）由柔性且可被蚀刻的聚合物形成，其包含与芯片的热膨胀系数无明显差异的热膨胀系数和/或CET与弹性的组合，其保持与 侧面的芯片和金属载体在芯片的预期工作温度范围内。 聚酰亚胺或对甲苯是优选的实例。 通孔（15）延伸穿过缓冲器以使金属载体与晶片背面上发现的金属层（5）电共同放置，使得施加到金属载体层（2）的电地可延伸到 表面。

公开(公告)号：US06741847B1

公开(公告)日：2004-05-25

申请号：US09605232

申请日：2000-06-28

申请人： Shimen K. Claxton ,  Mark Kintis ,  Craig R. Talbott

发明人： Shimen K. Claxton ,  Mark Kintis ,  Craig R. Talbott

IPC分类号： H04B110

CPC分类号： H04B1/0028 ,  H03D7/163 ,  H04B1/0003 ,  H04B1/0032 ,  H04B1/28

摘要： A frequency down-converter (18) for a receiver (10) in a wireless telecommunications system. The down-converter (18) is capable of simultaneously processing a plurality of signal channels without increased signal distortion over a relatively wide bandwidth. The frequency down-converter (18) employs a suitable mixer (28), bandpass filter (32), attenuator (34) and transformer (36) that are tuned to provide the desired frequency down-conversion and amplitude control over the desired wideband width. In one embodiment, the bandpass filter passes a frequency band at 25 MHz or above. The frequency down-converter (18) generates the IF signal in a single step down-conversion process, or generates the IF signal and then a baseband signal in a two step down-conversion process.

摘要翻译： 一种用于无线电信系统中的接收机（10）的下变频器（18）。 下变换器（18）能够在相对宽的带宽上同时处理多个信号通道而不增加信号失真。 降频转换器（18）采用合适的混频器（28），带通滤波器（32），衰减器（34）和变压器（36），其被调谐以在期望的宽带宽度上提供期望的频率下变频和幅度控制 。 在一个实施例中，带通滤波器通过25MHz或更高的频带。 降频转换器（18）在单步降压转换处理中产生IF信号，或者在两步下变频处理中产生IF信号，然后产生基带信号。

公开(公告)号：US06718161B1

公开(公告)日：2004-04-06

申请号：US09587316

申请日：2000-06-05

申请人： Kenneth E. Westall ,  Konstantinos Makrygiannis ,  Mark K. Christopher ,  Mark Kintis

发明人： Kenneth E. Westall ,  Konstantinos Makrygiannis ,  Mark K. Christopher ,  Mark Kintis

IPC分类号： H04Q720

CPC分类号： H04B7/2041

摘要： A multiple access communications system includes a communications unit, such as satellite or a mobile link base station, and an antenna disposed thereon. The antenna has the capability to direct an antenna beam at a selected user on a packet by packet basis thereby reducing the latency, buffering, and non-uniform gain distribution associated with conventional transmission systems.

摘要翻译： 多址通信系统包括诸如卫星或移动链路基站的通信单元和设置在其上的天线。 该天线具有在分组的基础上将所选用户的天线波束引导的能力，从而减少与常规传输系统相关联的等待时间，缓冲和不均匀的增益分布。

公开(公告)号：US06708400B2

公开(公告)日：2004-03-23

申请号：US09978341

申请日：2001-10-15

申请人： Mark Kintis ,  Charles G. Turner

发明人： Mark Kintis ,  Charles G. Turner

IPC分类号： H05K336

CPC分类号： H05K3/0061 ,  H05K1/0237 ,  H05K3/303 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2203/0173 ,  H05K2203/0278 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/5313 ,  Y10T29/53252 ,  Y10T29/53961

摘要： Reflow soldering of a variety of circuit boards (9, 11, 15) in a variety of sizes and shapes to assigned locations on the base or carrier (13) of the electronic module housing (3) is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. Instead, the solder-backed circuit boards are placed in assigned positions in the module housing and the inside volume of that housing is filled (22) with particulate, such as small beads (17), covering the circuit boards, but leaving the edges of the upstanding metal shields (5 and 7) visible. A plate (21) backed foam sheet (19) is placed over the module housing (24) and clamped down (26), pressing against the beads. The clamped assembly is then heated (28) to reflow the solder, soldering the circuit boards in place.

摘要翻译： 通过消除以前定制的金属块，简化了各种尺寸和形状的各种电路板（9,11,15）的回流焊接到电子模块外壳（3）的底座或托架（13）上的指定位置 用于将电路板夹在载体金属上。 相反，焊料背衬的电路板被放置在模块壳体中的分配位置中，并且该壳体的内部体积被填充（22），其具有覆盖电路板的颗粒，例如小珠（17），但是留下边缘 直立的金属屏蔽（5和7）可见。 将板（21）背衬的泡沫板（19）放置在模块壳体（24）上并且被夹紧（26），压靠珠子。 然后将夹紧的组件加热（28）以回流焊料，将电路板焊接到位。

公开(公告)号：US06515784B2

公开(公告)日：2003-02-04

申请号：US09840858

申请日：2001-04-24

申请人： Juan C. Carillo, Jr. ,  Bruce A. Ferguson ,  Richard A. Fields ,  Mark Kintis ,  Elizabeth T. Kunkee ,  Lawrence J. Lembo ,  Stephen R. Perkins ,  David L. Rollins ,  Eric L. Upton

发明人： Juan C. Carillo, Jr. ,  Bruce A. Ferguson ,  Richard A. Fields ,  Mark Kintis ,  Elizabeth T. Kunkee ,  Lawrence J. Lembo ,  Stephen R. Perkins ,  David L. Rollins ,  Eric L. Upton

IPC分类号： G02F103

CPC分类号： G02F3/00 ,  G02F1/3515

摘要： An optical inverting system employs a first optical structure having an index of refraction that varies with the intensity of an incident beam and a second optical structure having a constant index of refraction, and forming an interface therebetween. An optical pulse stream is combined with a laser beam and the combined beam is applied to the first optical structure, impinging the interface at a predetermined angle of incidence. If the angle of incidence is less than a critical angle, the beam is refracted into the second optical structure. If the angle of incidence is greater than the critical angle, the beam is completely reflected at the interface. Thus the output of the second optical structure is an inversion, and the output of the first optical structure is a level shifted replica, of the optical digital pulse stream.

公开(公告)号：US06121907A

公开(公告)日：2000-09-19

申请号：US133038

申请日：1998-08-11

申请人： Richard A. Fields ,  David L. Rollins ,  Stephen R. Perkins ,  Eric L. Upton ,  Elizabeth T. Kunkee ,  Lawrence J. Lembo ,  Juan C. Carillo, Jr. ,  Mark Kintis

发明人： Richard A. Fields ,  David L. Rollins ,  Stephen R. Perkins ,  Eric L. Upton ,  Elizabeth T. Kunkee ,  Lawrence J. Lembo ,  Juan C. Carillo, Jr. ,  Mark Kintis

IPC分类号： G02F7/00 ,  H03M1/00

CPC分类号： G02F7/00

摘要： An optical analog-to-digital converter (10) which fully operates in the optical domain and utilizes an upward-folding successive approximation approach for conversion. The converter (10) includes a plurality of optical stages (14, 16, 18) where each stage (14, 16, 18) generates a digital bit. Each stage (14, 16, 18) includes an optical threshold switch (30, 56, 78) that sets the bit high when the switch (30, 56, 78) is closed. When a sample amplitude of the analog signal is compared to a threshold value and found to exceed the threshold value, the bit is set to "high" and the sample is passed directly onto the next stage (14, 16, 18). If the sample amplitude is found to be less than the threshold value, the bit is set to "low" and an intensity equal to the maximum signal intensity minus the threshold intensity is added to the sample amplitude. Each successive stage (14, 16, 18) compares the normalized signal sample to thresholds growing closer and closer to the maximum signal intensity. Multiple bits can be obtained by cascading stages.

摘要翻译： 一种光学模拟 - 数字转换器（10），其在光学域中完全操作并且利用向上折叠的逐次逼近方法进行转换。 转换器（10）包括多个光学级（14,16,18），其中每个级（14,16,18）产生数字位。 每个级（14,16,18）包括一个光学阈值开关（30,56,78），当开关（30,56,78）关闭时，它将位置高。 当将模拟信号的采样幅度与阈值进行比较并发现超过阈值时，将该位设置为“高”，并将样本直接传递到下一级（14,16,18）。 如果发现样品振幅小于阈值，则该位被设置为“低”，并且将等于最大信号强度减去阈值强度的强度加到样本幅度上。 每个连续级（14,16,18）将归一化信号样本与越来越接近最大信号强度的阈值进行比较。 可以通过级联级获得多个位。

公开(公告)号：US5994982A

公开(公告)日：1999-11-30

申请号：US897120

申请日：1997-07-18

申请人： Mark Kintis ,  John J. Berenz

发明人： Mark Kintis ,  John J. Berenz

IPC分类号： H03B5/18 ,  H01P7/00 ,  H03B1/00

CPC分类号： H03B5/1847

摘要： A switched resonator formed from a series capacitor and a single microstrip transmission line with a plurality of RF switches to connect it to ground along its length. The microstrip transmission line is grounded at one end and the RF switches are used to tune its length. The other end of the microstrip transmission line is connected to the capacitor to form a resonator. The resonant frequency of the resonator is varied by grounding the center conductor through RF switches connected to ground at different points along its length, which effectively varies the electrical length of the transmission line connected to the capacitor thereby forming a switched resonator. The switched resonator is suitable for use with a single VCO to provide relatively wideband tuning of the significantly reduced size due to the use of a single VCO.

摘要翻译： 一种由串联电容器和具有多个RF开关的单个微带传输线形成的开关谐振器，以沿其长度将其连接到地面。 微带传输线在一端接地，RF开关用于调节其长度。 微带传输线的另一端连接到电容器以形成谐振器。 谐振器的谐振频率通过将中心导体通过沿其长度的不同点连接到地的RF开关接地来改变，这有效地改变了连接到电容器的传输线的电长度，从而形成开关谐振器。 开关谐振器适合与单个VCO一起使用，以便通过使用单个VCO来提供显着减小的尺寸的相对宽带调谐。