发明申请
US20070077748A1 Method for forming a semiconductor product and semiconductor product
审中-公开
用于形成半导体产品和半导体产品的方法
- 专利标题： Method for forming a semiconductor product and semiconductor product
- 专利标题（中）： 用于形成半导体产品和半导体产品的方法
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申请号： US11241877申请日： 2005-09-30
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公开(公告)号： US20070077748A1公开(公告)日： 2007-04-05
- 发明人: Dominik Olligs , Hocine Boubekeur , Veronika Polei , Nicolas Nagel , Torsten Mueller , Lars Bach , Thomas Mikolajick , Joachim Deppe
- 申请人： Dominik Olligs , Hocine Boubekeur , Veronika Polei , Nicolas Nagel , Torsten Mueller , Lars Bach , Thomas Mikolajick , Joachim Deppe
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763 ; H01L21/3205 ; H01L21/44
摘要：
A semiconductor product (1) includes a plurality of wordlines extending along a first lateral direction (x) along a substrate surface (22) and also includes contact structures (3) as well as filling structures (4) therebetween. Along the first direction (x) the contact structures (3) and the filling structures (4) are arranged in alternating order between two respective wordlines. Each contact structure (3) serves to connect two active areas (23) separated by one respective trench isolation filling (24) to a respective bitline (14). Accordingly, the width of the first contact structures (3) is much larger than the width of the bitlines (14) along the first direction (x). According to embodiments of the invention, tapered upper portions (9) of the contact structures (3) are shaped, the upper portions (9) having a width being significantly smaller than the width of the contact structures (3) along the first direction (x). Thereby, forming the bitlines (14) in direct contact to top surfaces (7) of contact structures (3) is possible without the risk of short circuits between adjacent bitlines (14).
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