摘要:
The present invention provides a manufacturing method for an integrated circuit and a corresponding integrated circuit. The integrated circuit comprises a plurality of first devices, each first device including a charge storage layer and a control electrode comprising a plurality of layers; and a plurality of second devices coupled to at least one of the plurality of first devices, each second device including a control electrode comprising at least one layer different from said plurality of layers.
摘要:
Disclosed is a semiconductor laser in which the substrate comprises at least three independent functional sections in the direction of light wave propagation, said functional sections serving different functions and being individually triggered by means of electrodes via electrode leads. An intensification zone, a grid zone, and a phase adjustment zone are provided as functional sections. The light wave is optically intensified in the intensification zone while the phase of the advancing and returning wave is adjusted in the phase adjustment zone. The grid zone is used for selecting the wavelength and adjusting the intensity of coupling between the intensification zone and the phase adjustment zone.
摘要:
An interlayer is disposed on a pattern surface of a substrate. A buried hard mask may be provided on the interlayer. The buried hard mask includes a template opening having a template length along a line axis and a template width perpendicular thereto. The buried hard mask is filled with a fill material. A top mask is provided above the filled buried hard mask. The top mask includes a trim opening crossing the template opening and having a trim width along the line axis that is smaller than the template length. By etching the fill material and the interlayer using the top and buried hard mask a process section of the pattern surface may be exposed such that a target length and width of the process section result from the template and the trim widths. The planar dimensions of the process section may be decoupled from each other.
摘要:
In an embodiment, an integrated circuit is provided. The integrated circuit may include an active area extending along a first direction corresponding to a current flow direction through the active area, a contact structure having an elongate structure. The contact structure may be electrically coupled with the active area. Furthermore, the contact structure may be arranged such that the length direction of the contact structure forms a non-zero angle with the first direction of the active area.
摘要:
A semiconductor product includes, a substrate with a first dielectric layer having contact hole fillings for contacting active areas in the substrate. A second dielectric layer with contact holes is provided therein. The contact holes have a width in a first lateral direction. The product further includes conductive lines, each conductive line passing over contact holes in the second dielectric layer and contacting a plurality of contact hole fillings in the first dielectric layer. The conductive lines have a width, in the first lateral direction, that is smaller than the width of the contact holes of the second dielectric layer. The conductive lines are in direct mechanical contact with the contact hole fillings and thereby remove the need to provide any conventional “contact to interconnect” structures.
摘要:
A semiconductor laser with a semiconductor substrate, a laser layer arranged on the semiconductor substrate, a waveguide arranged parallel to the laser layer and a strip shaped grating structure is disclosed. The laser layer, the waveguide and the grating are arranged a configuration which results in weak coupling between the laser light and the grating structure, so that the laser light interacts with an increased number of grating elements. A process for the production of such a semiconductor laser is also disclosed.
摘要:
A straw splitter for longitudinally splitting pieces of cereal straw into separated strands for use in making a panel, board or beam is provided. A cutting shear roller and a gripping shear roller are rotatable around their longitudinal axis at different circumferential speeds. The pieces of straw are split due to shear between the cutting shear roller and the gripping shear roller. The shear rollers each comprise parallel grooves with cutting edges oriented at a predetermined angle to the roller axis such that the grooves of the gripping shear roller cross the grooves of the cutting shear roller providing a scissoring action for splitting the straw into long strands.
摘要:
A method and apparatus for testing the stiffness or strength of wood panels while the panels are moving along a production line, in which the panels are moved lengthwise through a tester having lower rollers which are situated to support side or end marginal portions only of the panel while central upper rollers contacts a central region of the panel and subjects the panel to longitudinal or lateral bending. The forces corresponding to the bending are measured and used to obtain a measure of the stiffness or strength of the panel. Preferably, both a longitudinal and a lateral tester are provided, and each have two testing stations each applying a different amount of lateral bending, all of these amounts being in the substantially linear portion of the load deflection curve.
摘要:
A low amplitude wave-board panel having improved bending strength and bending stiffness properties is provided. More specifically, the amplitude of the waves is substantially equal to, or less than half the thickness of said board. Preferably, the wave amplitude ranges from between 1/8" to about 1".