发明申请
- 专利标题： System and Method for Noise Reduction in Multi-Layer Ceramic Packages
- 专利标题（中）： 多层陶瓷封装降噪系统及方法
-
申请号： US11538531申请日： 2006-10-04
-
公开(公告)号： US20070080436A1公开(公告)日： 2007-04-12
- 发明人: Sungjun Chun , Jason Frankel , Anand Haridass , Erich Klink , Brian Singletary
- 申请人： Sungjun Chun , Jason Frankel , Anand Haridass , Erich Klink , Brian Singletary
- 专利权人： IBM Corporation
- 当前专利权人： IBM Corporation
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A system and method for reducing noise in a multi-layer ceramic package are provided. With the system and method, additional shielding wires are inserted into the reference planes wherever there are no signal vias present. These additional lines in the reference planes force stronger signal interaction with the reference (vdd/gnd) thereby reducing the interaction between the signals in the signal layers. As a result, the noise present in the signals of the signal layers is reduced.
信息查询
IPC分类:
