发明申请
- 专利标题： Bond pads and methods for fabricating the same
- 专利标题（中）： 接合垫及其制造方法
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申请号： US11246088申请日： 2005-10-11
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公开(公告)号： US20070080460A1公开(公告)日： 2007-04-12
- 发明人: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
- 申请人： Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
Bond pads for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.
公开/授权文献
- US07646097B2 Bond pads and methods for fabricating the same 公开/授权日：2010-01-12
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