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公开(公告)号:US07646097B2
公开(公告)日:2010-01-12
申请号:US11246088
申请日:2005-10-11
申请人: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
发明人: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
IPC分类号: H01L23/48
CPC分类号: B29C43/222 , A44B17/0029 , A44B17/0058 , B29C43/28 , B29C2793/009 , B29L2031/7282 , B29L2031/729 , H01L24/05 , H01L24/06 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05647 , H01L2224/48463 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/04941 , H01L2924/05042 , H01L2924/14 , H01L2224/45099
摘要: Bond pads for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.
摘要翻译: 提供了用于半导体器件的接合焊盘及其制造方法。 接合焊盘具有具有多个开口的第一钝化层。 覆盖在开口和第一钝化层的部分上的导电层,其具有覆盖第一钝化层的第一部分和覆盖开口的第二部分。 第二钝化层覆盖在第一钝化层上并覆盖导电层的边缘。
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公开(公告)号:US20070080460A1
公开(公告)日:2007-04-12
申请号:US11246088
申请日:2005-10-11
申请人: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
发明人: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
IPC分类号: H01L23/52
CPC分类号: B29C43/222 , A44B17/0029 , A44B17/0058 , B29C43/28 , B29C2793/009 , B29L2031/7282 , B29L2031/729 , H01L24/05 , H01L24/06 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05647 , H01L2224/48463 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/04941 , H01L2924/05042 , H01L2924/14 , H01L2224/45099
摘要: Bond pads for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.
摘要翻译: 提供了用于半导体器件的接合焊盘及其制造方法。 接合焊盘具有具有多个开口的第一钝化层。 覆盖在开口和第一钝化层的部分上的导电层,其具有覆盖第一钝化层的第一部分和覆盖开口的第二部分。 第二钝化层覆盖在第一钝化层上并覆盖导电层的边缘。
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公开(公告)号:US08324731B2
公开(公告)日:2012-12-04
申请号:US12591532
申请日:2009-11-23
申请人: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
发明人: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
IPC分类号: H01L21/31
CPC分类号: B29C43/222 , A44B17/0029 , A44B17/0058 , B29C43/28 , B29C2793/009 , B29L2031/7282 , B29L2031/729 , H01L24/05 , H01L24/06 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05647 , H01L2224/48463 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/04941 , H01L2924/05042 , H01L2924/14 , H01L2224/45099
摘要: An integrated circuit device having at least a bond pad for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.
摘要翻译: 提供了至少具有用于半导体器件的接合焊盘的集成电路器件及其制造方法。 接合焊盘具有具有多个开口的第一钝化层。 覆盖在开口和第一钝化层的部分上的导电层,其具有覆盖第一钝化层的第一部分和覆盖开口的第二部分。 第二钝化层覆盖在第一钝化层上并覆盖导电层的边缘。
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公开(公告)号:US20100065969A1
公开(公告)日:2010-03-18
申请号:US12591532
申请日:2009-11-23
申请人: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
发明人: Chen-Hua Yu , Shwang-Ming Jeng , Yung-Cheng Lu , Huilin Chang , Ting-Yu Shen , Yichi Liao
IPC分类号: H01L23/532 , H01L23/48
CPC分类号: B29C43/222 , A44B17/0029 , A44B17/0058 , B29C43/28 , B29C2793/009 , B29L2031/7282 , B29L2031/729 , H01L24/05 , H01L24/06 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05647 , H01L2224/48463 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/04941 , H01L2924/05042 , H01L2924/14 , H01L2224/45099
摘要: An integrated circuit device having at least a bond pad for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.
摘要翻译: 提供了至少具有用于半导体器件的接合焊盘的集成电路器件及其制造方法。 接合焊盘具有具有多个开口的第一钝化层。 覆盖在开口和第一钝化层的部分上的导电层,其具有覆盖第一钝化层的第一部分和覆盖开口的第二部分。 第二钝化层覆盖在第一钝化层上并覆盖导电层的边缘。
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