Invention Application
- Patent Title: Method for manufacturing a thermal interface material
- Patent Title (中): 制造热界面材料的方法
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Application No.: US11432565Application Date: 2006-05-10
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Publication No.: US20070089667A1Publication Date: 2007-04-26
- Inventor: Bor-Yuan Hsiao
- Applicant: Bor-Yuan Hsiao
- Applicant Address: TW Tu-Cheng City
- Assignee: HON HAI Precision Industry CO., LTD.
- Current Assignee: HON HAI Precision Industry CO., LTD.
- Current Assignee Address: TW Tu-Cheng City
- Priority: CN200510100542.7 20051020
- Main IPC: C30B13/00
- IPC: C30B13/00 ; C30B21/04 ; C30B28/08
Abstract:
A method for manufacturing a thermal interface material includes the steps of providing filling particles and a base material; forming a mixture by putting the filling particles and the base material into a container, and keeping the base material melt or in liquid state, and pressing a predetermined pressure to the mixture and mixing the mixture uniformly
Information query
IPC分类:
