Abstract:
A method of manufacturing a thin film transistor array panel is provided, which includes: depositing an amorphous silicon layer on an insulating substrate; converting the amorphous silicon layer to a polysilicon layer by a plurality of laser shots using a mask; forming a gate insulating layer on the polysilicon layer; forming a plurality of gate lines on the gate insulating layer; forming a first interlayer insulating layer on the gate lines; forming a plurality of data lines on the first interlayer insulating layer; forming a second interlayer insulating layer on the data lines; and forming a plurality of pixel electrodes on the second interlayer insulating layer, wherein the mask comprises a plurality of transmitting areas and a plurality of blocking areas arranged in a mixed manner.
Abstract:
A method for manufacturing a thermal interface material includes the steps of providing filling particles and a base material; forming a mixture by putting the filling particles and the base material into a container, and keeping the base material melt or in liquid state, and pressing a predetermined pressure to the mixture and mixing the mixture uniformly
Abstract:
The invention relates to a technique for producing a high quality Si single crystal ingot with a high productivity by the Czochralski method. The technique of the invention can control the magnetic field strength of an oxygen dissolution region different from that of a solid-liquid interface region in order to control the oxygen concentration at a desired value.
Abstract:
Disclosed is a metod of fabrication of high quality silicon single crystal at high growth rate. The method grows silicon single crystal from silicon melt by Czochralski method, wherein the silicon single crystal is grown according to conditions that the silicon melt has an axial temperature gradient determined according to an equation, {(ΔTmax−ΔTmin)/ΔTmin}×100≦10, wherein ΔTmax is a maximum axial temperature gradient of the silicon melt and ΔTmin is a minimum axial temperature gradient of the silicon melt, when the axial temperature gradient is measured along an axis parallel to a radial direction of the silicon single crystal.
Abstract:
A method for manufacturing a crystal plate, comprising the steps of adhering one of an amorphous plate and a crystalline body integrally and merging with the amorphous plate and the crystalline body; and separating the amorphous plate from the crystalline body after the crystal structure of the crystalline body is copied to the amorphous plate so that the crystal structure of the crystalline body can be copied to the amorphous plate without the crystal structure in a short time (short period), and it is easy and cheap to form a crystal plate from the amorphous plate.
Abstract:
A perovskite compound of the formula, (Na1/2Bi1/2)1-xMx(Ti1-yM′y)O3±z, where M is one or more of Ca, Sr, Ba, Pb, Y, La, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb and Lu; and M′ is one or more of Zr, Hf, Sn, Ge, Mg, Zn, Al, Sc, Ga, Nb, Mo, Sb, Ta, W, Cr, Mn, Fe, Co and Ni, and 0.01
Abstract translation:一种下式的钙钛矿化合物,其中,(Na + 1/2/2/2/2)1/2 x (Ti 1-y M',Y')3 3 z z,其中M是Ca,Sr,Ba,Pb中的一种或多种, Y,La,Pr,Nd,Sm,Eu,Gd,Th,Dy,Ho,Er,Tm,Yb和Lu; 并且M'是Zr,Hf,Sn,Ge,Mg,Zn,Al,Sc,Ga,Nb,Mo,Sb,Ta,W,Cr,Mn,Fe,Co和Ni中的一种或多种, <0.3,0.01
Abstract:
A laser annealing apparatus includes a laser oscillating structure, an oscillator, a beam expanding telescope, a first power meter, and a second power meter. The laser oscillating structure emits a first laser beam of a first wavelength and first beam cross-section to a substrate in a chamber including an optical window. The oscillator emits a second laser beam, of a second wavelength different from the first wavelength, to the substrate. The beam expanding telescope is on an optical path for the second laser beam and expands the second laser beam to a second beam cross-section. The first and second power meters measure energy of the second laser beam and a third laser beam, generated as the second laser beam is reflected by the substrate. The first beam cross-section and the second beam cross-section may be equal.
Abstract:
Solid or semi-solid feedstock is melted in an open bottom electric induction cold crucible furnace. Directionally solidified multi-crystalline solid purified material continuously exits the bottom of the furnace and may optionally pass through a thermal conditioning chamber before being gravity fed into a transport mold where an ingot of the purified multi-crystalline solid material is transported to a remote holding area after the transport mold is filled with the multi-crystalline material and cut from the continuous supply of material. Cool down of the ingot is accomplished remote from the open bottom of the electric induction cold crucible furnace.
Abstract:
A single crystal of semiconductor material is produced by a method of melting semiconductor material granules by means of a first induction heating coil on a dish with a run-off tube consisting of the semiconductor material, forming a melt of molten granules which extends from the run-off tube in the form of a melt neck and a melt waist to a phase boundary, delivering heat to the melt by means of a second induction heating coil which has an opening through which the melt neck passes, crystallizing the melt at the phase boundary, and delivering a cooling gas to the run-off tube and to the melt neck in order to control the axial position of an interface between the run-off tube and the melt neck.
Abstract:
A mask for silicon crystallization capable of minimizing the number of grain boundaries in crystallized silicon, a method for crystallizing silicon using the mask, and a display device are presented. The mask includes a group of slits that are inclined at a predetermined angle with respect to a scan direction and a group of slits including slits inclined at a predetermined angle with respect to the former group of slits. The groups of slits are separated by an interval along the scan direction, and the substrate and/or mask is moved by the interval between irradiation by laser through the slits. Further, there are provided a method for crystallizing silicon using the mask and a display device. By reducing the number of grain boundaries that extend horizontally or vertically on the substrate, the invention obviates a design limitation associated with the directional anisotropy in sequential lateral solidification (SLS) technique.