发明申请
- 专利标题: Semiconductor chip package and fabrication method thereof
- 专利标题(中): 半导体芯片封装及其制造方法
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申请号: US11582565申请日: 2006-10-18
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公开(公告)号: US20070090540A1公开(公告)日: 2007-04-26
- 发明人: Akira Tokumitsu , Fumihiko Ooka , Hiroshi Kawano
- 申请人: Akira Tokumitsu , Fumihiko Ooka , Hiroshi Kawano
- 申请人地址: JP Tokyo
- 专利权人: OKI ELECTRIC INDUSTRY CO., LTD.
- 当前专利权人: OKI ELECTRIC INDUSTRY CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2005-195833 20050705
- 主分类号: H01L23/52
- IPC分类号: H01L23/52
摘要:
A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.
公开/授权文献
- US07489043B2 Semiconductor chip package and fabrication method thereof 公开/授权日:2009-02-10