公开(公告)号：US20080014680A1

公开(公告)日：2008-01-17

申请号：US11826468

申请日：2007-07-16

申请人： Akira Tokumitsu ,  Fumihiko Ooka

发明人： Akira Tokumitsu ,  Fumihiko Ooka

IPC分类号： H01L21/58

CPC分类号： B81C1/00333 ,  B81B2207/098 ,  B81C1/00301 ,  G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

摘要翻译： 半导体芯片封装包括第一半导体芯片，即具有可移动结构的MEMS芯片。 可移动结构具有可移动部分。 第一半导体芯片包括多个第一电极焊盘和第一密封部分。 第一密封部分是围绕可移动结构的框架部分的顶面上形成的闭环。 第一半导体芯片还包括用于密封可移动结构的薄板构件。 半导体芯片封装还包括第二半导体芯片。 第二半导体芯片具有多个第二电极焊盘。 半导体芯片封装还包括基板。 衬底具有第三电极焊盘。 第一和第二半导体芯片安装在基板上。 第一接合线将第一电极焊盘连接到第二电极焊盘。 第二接合线将第二电极焊盘连接到第三电极焊盘。

公开(公告)号：US07304395B2

公开(公告)日：2007-12-04

申请号：US11478850

申请日：2006-07-03

申请人： Akira Tokumitsu ,  Fumihiko Ooka

发明人： Akira Tokumitsu ,  Fumihiko Ooka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： B81C1/00333 ,  B81B2207/098 ,  B81C1/00301 ,  G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

摘要翻译： 半导体芯片封装包括第一半导体芯片，即具有可移动结构的MEMS芯片。 可移动结构具有可移动部分。 第一半导体芯片包括多个第一电极焊盘和第一密封部分。 第一密封部分是围绕可移动结构的框架部分的顶面上形成的闭环。 第一半导体芯片还包括用于密封可移动结构的薄板构件。 半导体芯片封装还包括第二半导体芯片。 第二半导体芯片具有多个第二电极焊盘。 半导体芯片封装还包括基板。 衬底具有第三电极焊盘。 第一和第二半导体芯片安装在基板上。 第一接合线将第一电极焊盘连接到第二电极焊盘。 第二接合线将第二电极焊盘连接到第三电极焊盘。

公开(公告)号：US07571647B2

公开(公告)日：2009-08-11

申请号：US11213982

申请日：2005-08-30

申请人： Kengo Takemasa ,  Fumihiko Ooka

发明人： Kengo Takemasa ,  Fumihiko Ooka

IPC分类号： G01P1/02

CPC分类号： G01P1/023 ,  G01P1/006 ,  G01P15/0802 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/0842 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： According to the present invention, a package for an acceleration sensor, includes an acceleration sensor which is proved with a first terminal; a package base; an adhesive layer provided on the package base; and a spacer provided between the adhesive layer and the acceleration sensor. The spacer comprises a second terminal, which is electrically coupled to the first terminal of the acceleration sensor.

摘要翻译： 根据本发明，一种用于加速度传感器的包装件，包括用第一端子证明的加速度传感器; 包装基地 设置在所述封装基座上的粘合层; 以及设置在粘合剂层和加速度传感器之间的间隔件。 间隔件包括电耦合到加速度传感器的第一端子的第二端子。

公开(公告)号：US07410829B2

公开(公告)日：2008-08-12

申请号：US11826468

申请日：2007-07-16

申请人： Akira Tokumitsu ,  Fumihiko Ooka

发明人： Akira Tokumitsu ,  Fumihiko Ooka

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： B81C1/00333 ,  B81B2207/098 ,  B81C1/00301 ,  G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

摘要翻译： 半导体芯片封装包括第一半导体芯片，即具有可移动结构的MEMS芯片。 可移动结构具有可移动部分。 第一半导体芯片包括多个第一电极焊盘和第一密封部分。 第一密封部分是围绕可移动结构的框架部分的顶面上形成的闭环。 第一半导体芯片还包括用于密封可移动结构的薄板构件。 半导体芯片封装还包括第二半导体芯片。 第二半导体芯片具有多个第二电极焊盘。 半导体芯片封装还包括基板。 衬底具有第三电极焊盘。 第一和第二半导体芯片安装在基板上。 第一接合线将第一电极焊盘连接到第二电极焊盘。 第二接合线将第二电极焊盘连接到第三电极焊盘。

公开(公告)号：US06677219B2

公开(公告)日：2004-01-13

申请号：US09917712

申请日：2001-07-31

申请人： Kiyoshi Hasegawa ,  Fumihiko Ooka

发明人： Kiyoshi Hasegawa ,  Fumihiko Ooka

IPC分类号： H01L2130

CPC分类号： H01L24/06 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.

摘要翻译： 半导体封装包括具有主表面的半导体芯片和在主表面上形成的第一焊盘。 半导体封装还包括具有（a）相对的第一和第二主表面的封装衬底，（b）在第一和第二主表面之间延伸的侧表面，（c）与侧表面相邻并沿着侧表面的焊盘形成区域（ d）形成在焊盘形成区域上的第二焊盘，（e）形成在封装基板的第一主表面上的外部电极，其中封装基板的第二主表面固定到半导体芯片的主表面，并且其中 外部电极电连接到第二焊盘。 半导体封装还包括将第一焊盘电连接到第二焊盘的接合线和覆盖接合线以及第一和第二焊盘的密封材料。

公开(公告)号：US06300685B1

公开(公告)日：2001-10-09

申请号：US09358366

申请日：1999-07-21

申请人： Kiyoshi Hasegawa ,  Fumihiko Ooka

发明人： Kiyoshi Hasegawa ,  Fumihiko Ooka

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.

摘要翻译： 半导体封装包括具有主表面的半导体芯片和在主表面上形成的第一焊盘。 半导体封装还包括具有（a）相对的第一和第二主表面的封装衬底，（b）在第一和第二主表面之间延伸的侧表面，（c）与侧表面相邻并沿着侧表面的焊盘形成区域（ d）形成在焊盘形成区域上的第二焊盘，（e）形成在封装基板的第一主表面上的外部电极，其中封装基板的第二主表面固定到半导体芯片的主表面，并且其中 外部电极电连接到第二焊盘。 半导体封装还包括将第一焊盘电连接到第二焊盘的接合线和覆盖接合线以及第一和第二焊盘的密封材料。

公开(公告)号：US07569917B2

公开(公告)日：2009-08-04

申请号：US11798989

申请日：2007-05-18

申请人： Masahiko Sugihara ,  Fumihiko Ooka

发明人： Masahiko Sugihara ,  Fumihiko Ooka

IPC分类号： H01L23/495

CPC分类号： H01L23/4985 ,  H01L21/563 ,  H01L24/13 ,  H01L24/14 ,  H01L24/49 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor chip, an insulating base film and first projecting electrodes. The first projecting electrodes are formed in a single row on one face of the semiconductor chip along the edge of the semiconductor chip. This face of the semiconductor chip faces a semiconductor chip mounting face of the base film. The semiconductor device also includes second projecting electrodes formed in a single row outside the row of first projecting electrodes. The height of the second projecting electrodes is smaller than the first projecting electrodes. The semiconductor device also includes first inner leads formed on the semiconductor chip mounting face of the base film. The first inner lead extend to the first projecting electrodes. The semiconductor device also includes an insulating film formed between the first inner leads and the semiconductor chip. The semiconductor device also includes second inner leads formed on the insulating film. The second inner lead extend to the second projecting electrodes.

摘要翻译： 半导体器件包括半导体芯片，绝缘基膜和第一突出电极。 第一突出电极沿着半导体芯片的边缘在半导体芯片的一个面上形成为一排。 半导体芯片的该面朝向基膜的半导体芯片安装面。 半导体器件还包括形成在第一突出电极列之外的单行中的第二突出电极。 第二突出电极的高度小于第一突出电极。 半导体器件还包括形成在基膜的半导体芯片安装面上的第一内引线。 第一内引线延伸到第一突出电极。 半导体器件还包括形成在第一内引线和半导体芯片之间的绝缘膜。 半导体器件还包括形成在绝缘膜上的第二内引线。 第二内引线延伸到第二突出电极。

公开(公告)号：US20090072381A1

公开(公告)日：2009-03-19

申请号：US12279402

申请日：2007-04-09

申请人： Masamichi Ishihara ,  Fumihiko Ooka ,  Yoshihiko Ino

发明人： Masamichi Ishihara ,  Fumihiko Ooka ,  Yoshihiko Ino

IPC分类号： H01L21/50 ,  H01L23/28

CPC分类号： H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1058 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： According to the present invention, a recess portion is formed in a package substrate which is formed of a multilayer organic substrate having a multilayer wiring, and an LSI chip is accommodated within the recess portion. Wiring traces are formed on the upper surface of a resin which seals the LSI chip connected to the multilayer wiring. The wiring traces are connected to terminal wiring traces connected to the multilayer wiring on the front face of the package substrate and to front-face bump electrodes for external connection on the upper surface of the resin. On the back face side of the package substrate, back-face bump electrodes for external connection are formed and connected to the multilayer wiring.

摘要翻译： 根据本发明，在具有多层布线的多层有机基板形成的封装基板中形成有凹部，在该凹部内容纳有LSI芯片。 在密封连接到多层布线的LSI芯片的树脂的上表面上形成接线迹线。 布线迹线连接到连接到封装基板前表面上的多层布线的端子布线迹线和在树脂上表面上用于外部连接的前面凸块电极。 在封装基板的背面侧形成有用于外部连接的背面凸块电极并连接到多层布线。

公开(公告)号：US20070090540A1

公开(公告)日：2007-04-26

申请号：US11582565

申请日：2006-10-18

申请人： Akira Tokumitsu ,  Fumihiko Ooka ,  Hiroshi Kawano

发明人： Akira Tokumitsu ,  Fumihiko Ooka ,  Hiroshi Kawano

IPC分类号： H01L23/52

CPC分类号： G01P1/023 ,  B81C1/00333 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

摘要翻译： 半导体芯片封装包括第一半导体芯片，即具有可移动结构的MEMS芯片。 可移动结构具有可移动部分。 第一半导体芯片包括多个第一电极焊盘和第一密封部分。 第一密封部分是围绕可移动结构的框架部分的顶面上形成的闭环。 第一半导体芯片还包括用于密封可移动结构的薄板构件。 半导体芯片封装还包括第二半导体芯片。 第二半导体芯片具有多个第二电极焊盘。 半导体芯片封装还包括基板。 衬底具有第三电极焊盘。 第一和第二半导体芯片安装在基板上。 第一接合线将第一电极焊盘连接到第二电极焊盘。 第二接合线将第二电极焊盘连接到第三电极焊盘。

公开(公告)号：US20070044557A1

公开(公告)日：2007-03-01

申请号：US11213982

申请日：2005-08-30

申请人： Kengo Takemasa ,  Fumihiko Ooka

发明人： Kengo Takemasa ,  Fumihiko Ooka

IPC分类号： G01P15/12

CPC分类号： G01P1/023 ,  G01P1/006 ,  G01P15/0802 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/0842 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： According to the present invention, a package for an acceleration sensor, includes an acceleration sensor which is proved with a first terminal; a package base; an adhesive layer provided on the package base; and a spacer provided between the adhesive layer and the acceleration sensor. The spacer comprises a second terminal, which is electrically coupled to the first terminal of the acceleration sensor.

摘要翻译： 根据本发明，一种用于加速度传感器的包装件，包括用第一端子证明的加速度传感器; 包装基地 设置在所述封装基座上的粘合层; 以及设置在粘合剂层和加速度传感器之间的间隔件。 间隔件包括电耦合到加速度传感器的第一端子的第二端子。